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Sintering of Sputtered Copper Nanoparticles on (001) Copper Substrates

Published online by Cambridge University Press:  10 February 2011

M. Yeadon ,
J. C. Yang ,
M. Ghaly ,
D. L. Olynick ,
R. S. Averback  and
J. M. Gibson
M. Yeadon
Affiliation:
Materials Research Laboratory, University of lllinois at Urbana-Champaign, Urbana IL 61801myeadon@uiuc.edu
J. C. Yang
Affiliation:
Materials Research Laboratory, University of lllinois at Urbana-Champaign, Urbana IL 61801myeadon@uiuc.edu
M. Ghaly
Affiliation:
Materials Research Laboratory, University of lllinois at Urbana-Champaign, Urbana IL 61801myeadon@uiuc.edu
D. L. Olynick
Affiliation:
Materials Research Laboratory, University of lllinois at Urbana-Champaign, Urbana IL 61801myeadon@uiuc.edu
R. S. Averback
Affiliation:
Materials Research Laboratory, University of lllinois at Urbana-Champaign, Urbana IL 61801myeadon@uiuc.edu
J. M. Gibson
Affiliation:
Materials Research Laboratory, University of lllinois at Urbana-Champaign, Urbana IL 61801myeadon@uiuc.edu
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Abstract

The sintering of sputtered copper nanoparticles with a thin film copper substrate has been studied in real time using a novel in-situ UHV TEM. Particles were generated by dc sputtering in argon and transferred directly into the microscope along a connecting tube. The particles were deposited onto a clean (001) copper substrate of thickness 40nm. As-deposited particles assume a random orientation on the copper substrate as evidenced by electron diffraction patterns. Upon annealing, however, the particles were observed to reorient and assume the orientation of the substrate. Reorientation of individual, isolated particles occurred at ∼200°C, primarily by grain-boundary motion and not by surface diffusion.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 457: Symposium V – Nanophase and Nanocomposite Materials II , 1996 , 179
Copyright
Copyright © Materials Research Society 1997

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References

REFERENCES

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