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Stress Evolution During Growth of Sputtered Ni/Cu Multilayers

Published online by Cambridge University Press:  10 February 2011

Vidya Ramaswamy ,
Bruce M. Clemens  and
William D. Nix
Vidya Ramaswamy
Affiliation:
Department of Materials Science and Engineering, Stanford UniversityStanford, CA 94305-2205
Bruce M. Clemens
Affiliation:
Department of Materials Science and Engineering, Stanford UniversityStanford, CA 94305-2205
William D. Nix
Affiliation:
Department of Materials Science and Engineering, Stanford UniversityStanford, CA 94305-2205
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Abstract

Results from in-situ measurements of stress during growth of (111)-textured Ni/Cu multilayers with small and large bilayer periods are presented. In multilayers with small bilayer periods, Ni is in uniform tension and Cu in uniform compression. This behavior is modeled as the growth of a coherent multilayer with alloying in the layers. In multilayers with large bilayer periods, stress relaxation is observed but the measured stresses are much lower than expected based on a Mathews-Blakeslee relaxation process. An alternative stress relaxation mechanism based on high defect densities is presented and discussed.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 528: Symposia AA – Mechanisms & Principals of Epitaxial Growth in Metallic Systems , 1998 , 161
Copyright
Copyright © Materials Research Society 1998

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