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Stress Generation and Relaxation during Film Heteroepitaxy on a Compliant Substrate with a Viscoelastic Glass Interlayer

Published online by Cambridge University Press:  17 March 2011

Zhaohua Feng ,
Edward G. Lovell ,
Roxann L. Engelstad ,
Peter D. Moran  and
Thomas F. Kuech
Zhaohua Feng
Affiliation:
Computational Mechanics Center, Mechanical Engineering Department University of Wisconsin, Madison, WI 53706, U.S.A
Edward G. Lovell
Affiliation:
Computational Mechanics Center, Mechanical Engineering Department University of Wisconsin, Madison, WI 53706, U.S.A
Roxann L. Engelstad
Affiliation:
Computational Mechanics Center, Mechanical Engineering Department University of Wisconsin, Madison, WI 53706, U.S.A
Peter D. Moran
Affiliation:
Materials Science and Engineering Department Michigan Technological University, Houghton, MI 49931, U.S.A
Thomas F. Kuech
Affiliation:
Department of Chemical Engineering University of Wisconsin, Madison, WI 53706, U.S.A
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Abstract

Lattice mismatch strain between films and substrates causes stresses in each and degrades the film quality. Compliant substrates can decrease the stresses and dislocation density in the film. A particular type of compliant substrate, which consists of a thin template, a handle wafer and a glass interlayer, is discussed here. Three-dimensional axisymmetric finite element models were developed to simulate the film-substrate structure and analyze stress generation and relaxation. The materials of film and template were considered as elastic but the glass interlayer was viscoelastic at the film growth temperature. Factors affecting stress generation and relaxation are reported.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 696: Symposium N – Current Issues in Heteroepitaxial Growth--Stress Relaxation and Self Assembly , 2001 , N3.19
Copyright
Copyright © Materials Research Society 2002

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