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Stress Measurements in Materials for Magnetic Recording

Published online by Cambridge University Press:  15 February 2011

V. Raman
Affiliation:
IBM - ADSTAR, San Jose, CA 95193.
K.R. Coffey
Affiliation:
IBM - ADSTAR, San Jose, CA 95193.
R. Umphress
Affiliation:
IBM - ADSTAR, San Jose, CA 95193.
J.K. Howard
Affiliation:
IBM - ADSTAR, San Jose, CA 95193.
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Abstract

Investigations of the mechanical behavior of materials used in magnetic recording is of considerable practical importance in order to assure reliable file performance. With this objective, we have investigated the magnitude of the internal stresses observed in four sputtered thin film materials typically used in magnetic recording. First, the magnitude of the stresses observed in sputtered carbon films with and without hydrogen were measured and the nature of stress relaxation and thermal stability in different ambicnts were investigated. Second, the magnitude of the internal stress in CoPtCr magnetic media with and without a Cr-based sublayer that enhances magnetic performance was examined. Finally, the magnitude of stresses typically observed in thicker sputtered films of alumina were investigated both at room temperature and at elevated temperatures. The magnitude of the stresses observed in these sputtered films and their influence on mechanical performance are discussed.

Type
Research Article
Copyright
Copyright © Materials Research Society 1993

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References

REFERENCES

1 Bhushan, B., Tribology and Mechanics of Magnetic Storage Devices, Springer-Verlag, New York (1990).Google Scholar
2 Mee, C.D. and Daniel, E.D., Magnetic Recording, Vol.1: Technology, McGraw-Hill, New York (1987)Google Scholar
3 Howard, J.K., J. Vac. Sci. Technol., A4, 1 (1986).Google Scholar
4 Davidenkov, N.N., Soviet Physics - Solid State 2, 2595 (1961).Google Scholar
5 Campbell, D.S., Handbook of Thin Film Technology, McGraw-Hill, New York (1970)Google Scholar
6 Raman, V. and Coffey, K.R., Appl. Phys. Lett., 59,3244 (1991).CrossRefGoogle Scholar