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Tailoring the Microstructure of Polyimide-Silica Materials Using the Sol-Gel Process

Published online by Cambridge University Press:  10 February 2011

J. C. Schrotter
Affiliation:
LMPM, UMR 5635 CNRS, UMIH, ENSCM, 8 rue de l'Ecole Normale, 34053 Montpellier, Francesmaihi@critl .univ-montp2.fr
M. Smaihi
Affiliation:
LMPM, UMR 5635 CNRS, UMIH, ENSCM, 8 rue de l'Ecole Normale, 34053 Montpellier, Francesmaihi@critl .univ-montp2.fr
C. Guizard
Affiliation:
LMPM, UMR 5635 CNRS, UMIH, ENSCM, 8 rue de l'Ecole Normale, 34053 Montpellier, Francesmaihi@critl .univ-montp2.fr
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Abstract

Polyimide-silica materials have been prepared via the sol-gel process by mixing tetramethoxysilane with a polyamic acid. Two polyamic acids have been used. The first is obtained with an equimolar mixture of oxydianiline (ODA) and pyromellitic dianhydride (PMDA) in dimethyacetamide. The second is prepared with a mixture of PMDA with aminopropyltrimethoxysilane (APrTMOS).

The microstructure of the materials obtained with these two polyamic acids are drastically different. The presence of both amino and methoxy side-groups on the APrTMOS enables a chemical bonding between the organic and the inorganic networks resulting in the formation of homogeneous films. On the other side, no chemical bond is provided by the ODA-PMDA polyamic acid resulting in a biphasic microstructure where pure silica particles are embedded in a polyimide matrix.

These two types of materials have been characterized in order to point out the key parameters of their microstructure. 29Si NMR, thermogravimetric analysis, scanning electron microscopy and infra-red spectroscopy have been used to study materials containing various proportions of TMOS and prepared with various hydrolysis ratios.

Type
Research Article
Copyright
Copyright © Materials Research Society 1996

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