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Tensile Strength and Creep Resistance in Nanocrystalline Cu, Pd and Ag

Published online by Cambridge University Press:  28 February 2011

G. W. Nieman ,
J. R. Weertman  and
R. W. Siegel
G. W. Nieman
Affiliation:
Department of Materials Science and Engineering, Northwestern University, Evanston, IL 60208
J. R. Weertman
Affiliation:
Department of Materials Science and Engineering, Northwestern University, Evanston, IL 60208
R. W. Siegel
Affiliation:
Materials Science Division, Argonne National Laboratory, Argonne, IL, 60439

Abstract

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Measurements of tensile strength and creep resistance have been made on bulk samples of nanocrystalline Cu, Pd and Ag consolidated from powders by cold compaction. Samples of Cu-Cu2O have also been tested. Yield strength for samples with mean grain sizes of 5–80 nm and bulk densities on the order of 95% of theoretical density are increased 2–5 times over that measured in pure, annealed samples of the same composition with micrometer grain sizes. Ductility in the nanocrystalline Cu has exceeded 6% true strain, however, nanocrystalline Pd samples were much less ductile. Constant load creep tests performed at room temperature at stresses of >100 MPa indicate logarithmic creep. The mechanical properties results are interpreted to be due to grain size-related strengthening and processing flaw-related weakening.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 206: Symposium G – Clusters and Cluster-Assembled Materials , 1990 , 581
Copyright
Copyright © Materials Research Society 1991

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