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Thermal and Mechanical Properties of Cyclized Polybutadiene Dielectrics

Published online by Cambridge University Press:  25 February 2011

C. W. Wilkins Jr. ,
H. E. Bair ,
M. G. Chan  and
R. S. Hutton
C. W. Wilkins Jr.
Affiliation:
AT&T Bell Laboratories, Murray Hill, New Jersey 07974
H. E. Bair
Affiliation:
AT&T Bell Laboratories, Murray Hill, New Jersey 07974
M. G. Chan
Affiliation:
AT&T Bell Laboratories, Murray Hill, New Jersey 07974
R. S. Hutton
Affiliation:
AT&T Bell Laboratories, Murray Hill, New Jersey 07974
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Abstract

We have studied some of the physical and mechanical properties of cyclized polybutadiene (CBR) dielectrics by dynamic mechanical analysis, thermal mechanical analysis, thermogravimetry, infrared analysis, and differential scanning calorimetry. Of interest is the difference in properties between thin (<30 μm) films which have been cured under vacuum and those which have been cured in air. Our results indicate that curing under vacuum prevents oxidation and reduces crosslinking. Vacuum cured films have 20% smaller moduli and 200 lower glass transition temperature than do films produced in air.

Type
Articles
Information
MRS Online Proceedings Library (OPL) , Volume 76: Symposium C – Science and Technology of Microfabrication , 1986 , 359
Copyright
Copyright © Materials Research Society 1987

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References

REFERENCES

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