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Thermo-Mechanical Properties of Terfenol-D Thin Films

Published online by Cambridge University Press:  16 February 2011

Quanmin Su
Affiliation:
Department of Materials and Nuclear Engineering University of MarylandCollege Park, MD 20742-2115, USA
Y. Zheng
Affiliation:
Department of Materials and Nuclear Engineering University of MarylandCollege Park, MD 20742-2115, USA
Manfred Wuttig
Affiliation:
Department of Materials and Nuclear Engineering University of MarylandCollege Park, MD 20742-2115, USA
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Abstract

The thermo-mechanical properties of Terfenol-D thin films deposited on Si substrates werestudied by static and dynamic measurements of film/substrate composite cantilevers. The Curie transition, δE effect and mechanical damping of the film were measuredsimultaneously. The stress in the film was controlled by annealing below the recrystallization temperature and determined to vary from -500 MPa, compression, in as deposited films to +480 MPa, tension, in annealed films. The Curie temperature shifts from 80ºC to 140ºC as the tension increases while the structure of the film remains amorphous. The stress change induced by annealing also drastically effects the film's damping characteristics. The δE effect of the amorphous material, about 20%, wasused to estimate the magnetostriction, λs≈4.10-3.

Type
Research Article
Copyright
Copyright © Materials Research Society 1995

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