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Ungated Vacuum Field Emission from Ordered Arrays of Microlithographically Defined Cylinders

Published online by Cambridge University Press:  25 February 2011

James J. Hickman ,
J. H. Georger ,
M. Anderson ,
G. L. Bergeron  and
D. A. Kirkpatrick
James J. Hickman
Affiliation:
Science Applications International Corp., 1710 Goodridge Drive, McLean, VA 22102
J. H. Georger
Affiliation:
GEO-Centers, Inc., Fort Washington, MD 20744
M. Anderson
Affiliation:
GEO-Centers, Inc., Fort Washington, MD 20744
G. L. Bergeron
Affiliation:
Science Applications International Corp., 1710 Goodridge Drive, McLean, VA 22102
D. A. Kirkpatrick
Affiliation:
Science Applications International Corp., 1710 Goodridge Drive, McLean, VA 22102
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Abstract

A new process has been developed which allows electroless metal deposition on ordered arrays of resist structures with high aspect ratios (10–25 μm tall x 0.5–13 μm diameter). The fabricated structures have demonstrated ungated vacuum field emission at fields of 80–300 kV/cm in background pressures of 5 × 10-6 torr. The surface composition and Interface contamination relate directly to cathode performance. Cathode performance can be optimized by controlling the chemistry at these interfaces. X-ray Photoelectron Spectroscopy depth profiles, Scanning Auger Electron Spectroscopy, and Scanning Electron Microscopy have been used to characterize this system. These structures have potential vacuum microelectronics applications such as addressable electron emitters for flat panel displays.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 260: Symposium C – Advanced Metallization and Processing for Semiconductor Devices and Circuits , 1992 , 423
Copyright
Copyright © Materials Research Society 1992

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