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Viscoelastic Behavior of Polymer Thin‐Films Under Thermal Stresses

Published online by Cambridge University Press:  10 February 2011

Stephen D. Bluestein ,
Dewi P. Y. Bramono ,
Ioannis N. Miaoulis  and
Peter Y. Wong
Peter Y. Wong
Affiliation:
Thermal Analysis of Materials Processing Laboratory, Mechanical Engineering Department, Tufts University, Medford, MA 02155
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Abstract

Stresses and deformation in microelectronic packaging are affected by the viscoelastic behavior of polymer materials during manufacture or operation. Predicting and measuring these thermo‐mechanical effects is important for new devices, components, and materials. The viscoelastic response of Nycoa 851 polyimide thin‐films during thermal loading is investigated. The time‐dependent relaxation of polyimide films was measured in‐situ, focusing on the change in thermo‐mechanical properties based on the thickness of the polyimide layer. The curvature change of the multilayer structure (silver‐polyimide‐quartz heterostructure) was obtained for different temperatures and polymer film thicknesses. The polyimide relaxation time constant and activation energy were determined. Results indicate that the thermo‐mechanical properties of polyimide thin films are dependent on the thickness of the polymer layer.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 445: Electronic Packaging Materials Science IX , 1996 , 185
Copyright
Copyright © Materials Research Society 1997

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