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XPS and Electrochemical Studies on Tungsten-Oxidizer Interaction in Chemical Mechanical Polishing
Published online by Cambridge University Press: 10 February 2011
Abstract
Electrochemical interaction between the oxidizer and the metal is believed to play a key role in material removal in tungsten CMP. In this study, we use X-ray Photoelectron Spectroscopy (XPS) in conjunction with electrochemical measurements in both in-situ polishing conditions as well as in static solutions, to identify the passivation and dissolution modes of tungsten. Dissolution of tungsten oxides was found to be the primary non-mechanical tungsten removal mechanism in CMP.
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- Copyright © Materials Research Society 2000
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