Hostname: page-component-76fb5796d-2lccl Total loading time: 0 Render date: 2024-04-26T00:47:57.727Z Has data issue: false hasContentIssue false
  • English
  • Français

High Temperature Polymer Nanofoams

Published online by Cambridge University Press:  15 February 2011

J. Hedrick ,
J. Labadie ,
T. Russell ,
V. Wakhiarkar  and
D. Hofer
J. Hedrick
Affiliation:
IBM Almaden Research Center, 650 Harry Road, San Jose, California 95120-6099
J. Labadie
Affiliation:
IBM Almaden Research Center, 650 Harry Road, San Jose, California 95120-6099
T. Russell
Affiliation:
IBM Almaden Research Center, 650 Harry Road, San Jose, California 95120-6099
V. Wakhiarkar
Affiliation:
IBM Almaden Research Center, 650 Harry Road, San Jose, California 95120-6099
D. Hofer
Affiliation:
IBM Almaden Research Center, 650 Harry Road, San Jose, California 95120-6099
Get access

Abstract

A means of generating high temperature polymer foams which leads to pore sizes in the nanometer regime has been developed. Foams were prepared by casting block copolymers comprised of a thermally stable block and a thermally labile material, such that the morphology provides a matrix of the thermally stable material with the thermally labile material as the dispersed phase. Upon a thermal treatment, the thermally unstable block undergoes thermolysis leaving pores where the size and shape of the pores are dictated by the initial copolymer morphology. Nanopore foam formation is shown for triblock copolymers comprised of a poly(phenylquinoxaline) matrix with poly(propylene oxide) as the thermally labile block. Upon decomposition of this block, a 10–20% reduction in density was observed, consistent with the initial PO composition, and the resulting PPQ foam showed a dielectric constant of ∼ 2.4, substantially lower than PPQ (2.8). Small angle X-ray scattering and transmission electron microscopy show pore sizes of approximately 100Å.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 274: Symposium R – Submicron Multiphase Materials , 1992 , 37
Copyright
Copyright © Materials Research Society 1992

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. Tummala, R.R. and Rymaszewski, E.J., Microelectronics Packaging Handbook (Van Nostrand Reinhold, New York, 1989a), Chapter 1.Google Scholar
2. SixefRTM) is a commercial polyimide marketed by llocchst-Cclanese.Google Scholar
3. Critchlen, J.S., Gratan, P.A., White, M.A., and Pippett, J.S., J. Polym. Sci.: Part A-I 10, 1789 (1972).Google Scholar
4. Harris, F. W., Hsu, S.L.C., Lee, C.J., Lee, B.S., Arnold, F., and Cheng, S.Z.D., Mats. Res. Soc. Symp. Proc. 227, 3 (1991).Google Scholar
5. Sasaki, S., Matsuora, T., Nishi, S., and Ando, S., Mats. Res. Soc. Symp. Proc. 227, 49 (1991).Google Scholar
6. Labadie, J. and Hedrick, J., J. Polym. Sci., Polym. Chem. Ed. 000 (1992).Google Scholar
7. Hergenrother, P.M. and Levine, H.H., J. Polym. Sci., Polym. Chem. Ed. 5, 1453 (1967).Google Scholar
8. Hergenrother, P.M., J. Macromol. Sci., Rev. Macromol. Chem. C6, 1 (1971).CrossRefGoogle Scholar
9. Flergenrother, P.M., J. Appl. Polym. Sci. 18, 1779 (1974).Google Scholar
10. Debye, P. and Beuche, A.M., J. Appl. Phys. 20, 518 (1940).Google Scholar
11. Debye, P., Anderson, H.R., and Brumberger, H., J. Appl. Phys. 28, 679 (1957).Google Scholar
12. Kratky, O., J. Pure and Appl. Chem. 12, 483 (1966).Google Scholar