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In situ Fracture and Adhesion Failure of Al-Cu-Fe Quasicrystalline Films

Published online by Cambridge University Press:  11 February 2011

M. J. Daniels ,
B. L. French ,
David King  and
J. C. Bilello
M. J. Daniels
Affiliation:
Center for Nanomaterials Science, Department of Materials Science and Engineering, University of Michigan, 2300 Hayward St., Ann Arbor, MI 48109–2136
B. L. French
Affiliation:
Center for Nanomaterials Science, Department of Materials Science and Engineering, University of Michigan, 2300 Hayward St., Ann Arbor, MI 48109–2136
David King
Affiliation:
Technology Assessment and Transfer, Annapolis, MD, 21108
J. C. Bilello
Affiliation:
Center for Nanomaterials Science, Department of Materials Science and Engineering, University of Michigan, 2300 Hayward St., Ann Arbor, MI 48109–2136
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Abstract

Quasicrystalline precursor coatings were deposited on single crystal silicon and sapphire wafers by RF sputtering from an AlCuFe powder composite target. Synchrotron white beam radiography/topography and stress analysis were performed in situ on the wafers during heating to 495 or 585°C, and subsequent cooling. A plateau region of constant stress was present throughout most of the 1 hour anneals before a large tensile stress developed in the film during cooling due to coefficient of thermal expansion mismatch. Cracking was observed for films on both substrates at an average film stress of approximately 930 MPa. Distinct differences in the fracture behavior were observed for the two different substrates. X-ray diffraction performed on films after annealing suggested that texturing took place during the transition to a fully developed quasicrystalline structure.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 750: Symposium Y – Surface Engineering 2002–Synthesis, Characterization and Applications , 2002 , Y3.3
Copyright
Copyright © Materials Research Society 2003

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References

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