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Stress-Induced Martensite in NiTi Corrugated Films

Published online by Cambridge University Press:  15 February 2011

Manfred Wuttig
Affiliation:
Department of Materials Science and Engineering University of Maryland, College Park, MD, 20742-2115, USA
J. S. Slutsker
Affiliation:
Department of Materials Science and Engineering University of Maryland, College Park, MD, 20742-2115, USA
Kiyotaka Mori
Affiliation:
Department of Materials Science and Engineering University of Maryland, College Park, MD, 20742-2115, USA
Jiang Li
Affiliation:
Department of Materials Science and Engineering University of Maryland, College Park, MD, 20742-2115, USA
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Abstract

Films deposited on corrugated surfaces develop non-uniform stresses when cooled from the deposition temperature. A disclination model shows that the stresses have rhombohedral and tetragonal components which can preferentially stress induce the martensite variants. The deflection of NiTi/Si bimorphs caused by the formation of martensite should thus be different if the NiTi/Si interface is corrugated or not. Experimental results confirm this expectation.

Type
Research Article
Copyright
Copyright © Materials Research Society 2000

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References

1 Hua, Z. S., Su, C. M. and Wuttig, Manfred, Proc. Symp. on Damping in Multiphase Inorganic Materials, Bhagat, R. B., Ed., AMS, Metals Park, OH, 1993, pp. 159, 165,Google Scholar
Miyazaki, S. et al. , ICOMAT 95, J. de Physique IV, 5, C8-665ff (1995),Google Scholar
Krulevitch, P., Ramsey, P. B. and Johnson, G. C., Thin Solid Films 274, 101 (1996),10.1016/0040-6090(95)07072-9Google Scholar
Quandt, E., Halene, C., Holleck, H., Feit, K., Kohl, M., Schloßmacher, P., Skokan, A., Skrobanek, K.D., Sensors and Actuators A53, 433 (1995).Google Scholar
2 Winzek, B., Quandt, E., Holleck, H., Proc. Actuator 98, Bremen 1998, p. 461.Google Scholar
3 Hou, Li, Pence, T. J. and Grummon, D. S., Mat. Res. Soc. Proc. 360, 369 (1995).10.1557/PROC-360-369Google Scholar
4 Roytburd, Alexander, S., T., Su, Quanmin, Slutsker, J. S. and Wuttig, Manfred, Acta Mat. 46, 5095 (1998).10.1016/S1359-6454(98)00165-7Google Scholar
5 Su, Quanmin, Zheng, Yun and Wuttig, Manfred, Appl. Phys. Letters, 73, August (1998).Google Scholar
6 Hua, Z. S., Su, C. M. and Wuttig, Manfred, Proc. Symp. on Damping in Multiphase Inorganic Materials, Bhagat, R. B., Ed., AMS, Metals Park, OH, 1993, pp. 159, 165.Google Scholar
7 Su, Q., Kim, T. and Wuttig, Manfred, MRS Symp. Proc. 360, 375 (1995).Google Scholar
8 Morillo, J., Su, Quanmin, Novotny, Don and Wuttig, Manfred, Rev. Sci. Instrum., 69, 3908 (1998).10.1063/1.1149198Google Scholar
9 Finne, R. M. and Klein, D. L., J. Elechtrochem. Soc. 114,965 (1967).10.1149/1.2426793Google Scholar
10 Nakamura, N., Ohshima, T. and Nakagawa, K., Jpn. J. Appl. Phys. 31, 2775 (1992).Google Scholar
11 Al-Bayati, A. H., Orrman-Rossiter, K. G. and Van den Bert, J. A., Surface Science 241, 91 (1991).10.1016/0039-6028(91)90214-DGoogle Scholar
12 Su, Quanmin, Zheng, Yun and Wuttig, Manfred, Appl. Phys. Letters, 73, 750 (1998).10.1063/1.121989Google Scholar
13 Romanov, A. E. and Vladimirov, V. I, phys. stat. sol. A59, K159 (1980),10.1002/pssa.2210590264Google Scholar
Romanov, A. E., Pompe, W., and Speck, J. S., J. Appl. Phys. 79/8, 4037 (1996).10.1063/1.361866Google Scholar
14 Vladimirov, V. I. and Romanov, A. E., Disclinations in Crystals, Nauka, Leningrad, 1986.Google Scholar
15 Slutsker, J. S., Roytburd, A. L. and Wuttig, Manfred, unpublished work.Google Scholar