Hostname: page-component-76fb5796d-qxdb6 Total loading time: 0 Render date: 2024-04-26T11:26:38.572Z Has data issue: false hasContentIssue false

An Investigation of Film Thickness Effect on Mechanical Properties of Au Films Using Nanoindentation Techniques

Published online by Cambridge University Press:  01 February 2011

Yifang Cao
Affiliation:
Princeton Institute of Materials Science and Engineering(PRISM) and Department of Mechanical and Aerospace Engineering Princeton University Princeton, NJ 08544
Zong Zong
Affiliation:
Princeton Institute of Materials Science and Engineering(PRISM) and Department of Mechanical and Aerospace Engineering Princeton University Princeton, NJ 08544
Wole Soboyejo
Affiliation:
Princeton Institute of Materials Science and Engineering(PRISM) and Department of Mechanical and Aerospace Engineering Princeton University Princeton, NJ 08544
Get access

Abstract

This paper presents the results of nanoindentation experimental studies of Au thin films with different thicknesses. The effects of film thickness and microstructure on the hardnesses of electron-beam deposited Au films were studied in terms of Hall-Petch relationship. The effects of different thicknesses on indentation size effects (ISE) are explained within the framework of mechanism-based strain gradient (MSG) theory using the concept of microstructural length scale.

Type
Research Article
Copyright
Copyright © Materials Research Society 2005

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

[1] Majumder, S., McGruer, N. E., Adams, G. G., Zavracky, P. M., Morrison, R. H., and Krim, J., Sensors and Actuators A - Physical, 93, 19, 2001.Google Scholar
[2] Zavracky, P., McGruer, N., and Majumder, S., J. Micro-electromech. Systems, 6, 3, 1997.Google Scholar
[3] Plummer, J., Deal, M., and Griffin, P., Silicon VLSI Technology: Fundamentals, Practice and Modeling. Upper Saddle River, NJ: Prentice Hall, 2000.Google Scholar
[4] Holliday, R. and Goodman, P., IEE Review, 48, 15, 2002.Google Scholar
[5] GadElHak, M., The MEMS Handbook. New York: CRC Press, 2002.Google Scholar
[6] Xu, Z. and Rowcliffe, D., Surface and Coatings Technology, 157, 231, 2002.Google Scholar
[7] Smith, J. F. and Zheng, S., Surface Engineering, 16, 143, 2000.Google Scholar
[8] Emery, R. and Povirk, G., Acta Materialia, 51, 2067, 2003.Google Scholar
[9] Espinosa, H. D. and Prorok, B., Journal of Materials Science, 38, 4125, 2003.Google Scholar
[10] Gall, K., West, N., Spark, K., Dunn, M. L., and Finch, D. S., Acta Materialia, 52, 2133, 2004.Google Scholar
[11] Doerner, M. F. and Nix, W. D., J. Mater. Res., 1, 601, 1986.Google Scholar
[12] Oliver, W. C. and Pharr, G. M., J. Mater. Res, 7, 1564, 1992.Google Scholar
[13] Pharr, G. M. and Oliver, F. B. W. C., J. Mater. Res, 7, 613, 1992.Google Scholar
[14] Lou, J., Shrotriya, P., Buchheit, T., Yang, D., and Soboyejo, W. O., Journal of Materials Research, 18, 719, 2003.Google Scholar
[15] Saha, R. and Nix, W. D., Acta Materialia, 50, 23, 2002.Google Scholar
[16] Nix, W. D. and Gao, H., J. Mech. Phys. Solids, 46, 411, 1998.Google Scholar
[17] Ma, Q. and Clark, D. R., J. Mater. Res., 10, 853, 1995.Google Scholar
[18] Aldazabal, J. and Sevillano, J. G., Materials Science and Engineering A, 365, 186, 2004.Google Scholar
[19] Xiang, Y., Chen, X., and Vlassak, J. J., Mat. Res. Soc. Symp. Proc, 695, L.4.96, 2002.Google Scholar
[20] Chang, J. F., Kuo, H. H., Leu, I., and Hon, M. H., Sensors and Actuators B: Chemical, 84, 258, 2002.Google Scholar
[21] Aguilar, M., Quintana, P., and Oliva, A. I., Materials and Manufacturing Processes, 17, 57, 2002.Google Scholar
[22] Sakai, S., Tanimoto, H., and Mizubayashi, H., Acta Materialia, 47, 211, 1999.Google Scholar
[23] Trimble, T., Cammarata, R., and Sieradzki, K., Surface Sicence, 531, 8, 2003.Google Scholar
[24] Begley, M. and Hutchinson, J., J. Mech. Phys. Solids., 46, 2049, 1998.Google Scholar