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Interfacing Ag Nanoparticles with 1D Semiconductor Micro/Nanostructures via Joule Heating for Transfer Printing Nanodevices at Room Ambient

Published online by Cambridge University Press:  31 October 2012

VJ Logeeswaran ,
Aaron M. Katzenmeyer ,
Mark Triplett ,
Matthew Ombaba  and
M. Saif Islam
VJ Logeeswaran
Affiliation:
Department of Electrical and Computer Engineering, University of California-Davis, CA 95616.
Aaron M. Katzenmeyer
Affiliation:
Sandia National Laboratories, Livermore, CA 94551.
Mark Triplett
Affiliation:
Department of Electrical and Computer Engineering, University of California-Davis, CA 95616. Department of Physics, University of California-Davis, CA 95616.
Matthew Ombaba
Affiliation:
Department of Electrical and Computer Engineering, University of California-Davis, CA 95616.
M. Saif Islam
Affiliation:
Department of Electrical and Computer Engineering, University of California-Davis, CA 95616.
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Abstract

We describe an experiment to interface and characterize silver nanoparticle (AgNPs) aggregates that are self-assembled and plastically deformable on a thin gold (Au) film deposited on glass substrate. The electrical characterization is done using an electrical nanoprobe attached to a nano-manipulator inside a scanning electron microscope (SEM). Electrical current-voltage (I-V) measurements are made between the electrical nanoprobe in contact with the nanoparticle and the Au film. The Ag nanoparticles have diameters ranging between ~200-800nm and are self-assembled on a thiolated 100nm Au film. Application of a contact force via the nanoprobe even after substantial particle deformation reveals initially a small non-linear current. Upon current annealing through Joule heating, significant improvement in the electrical contact at the AgNP/substrate interface was observed. This is most likely based on bonding of the AgNPs to the Au film after passage of a high current. The need for such an annealing/sintering step will be critical in forming good ohmic contacts at ambient conditions during transfer printing of semiconductor micro/nanopillars.

Keywords

sinteringself-assemblynano-indentation
Type
Articles
Information
MRS Online Proceedings Library (OPL) , Volume 1429: Symposium D – Nanocontacts—Emerging Materials and Processing for Ohmicity and Rectification , 2012 , mrss12-1429-d03-20
Copyright
Copyright © Materials Research Society 2012

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References

REFERENCES

Logeeswaran, VJ, Katzenmeyer, A. M., and Islam, M. S., IEEE Trans. On Electron. Devices 57, 1856 (2010)Google Scholar
Logeeswaran, VJ, Oh, J., Nayak, A.P., Katzenmeyer, A.M., Islam, M.S., Grego, S. and Gilchrist, K.H., Talin, A.A., Dhar, N.K., Kobayashi, N.P., Wang, S-Y., Williams, R.S., Journal of Selected Topics in Quantum Electronics Google Scholar
Hummelga, M., Zhang, R., Nilsson, H.-E., Olin, H., PLoS ONE 6, 17209, (2011).CrossRefGoogle Scholar
Katzenmeyer, A. M., Léonard, F., Talin, A. A., Wong, P.-S., and Huffaker, D. L., Nano Letters 10, 4935 (2010).CrossRefGoogle Scholar
Liang, H., Li, Z., Wang, W., Wu, Y., Xu, H., Advanced Materials 21, 4614, (2009).CrossRefGoogle Scholar
Li, Y., Moon, K.S., and Wong, C.P., Journal of Electronic Materials 34, 1573, (2005).CrossRefGoogle Scholar