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High-density Co/Al2O3 core-shell nanocrystal memory

Published online by Cambridge University Press:  25 May 2012

Huimei Zhou
Affiliation:
Department of Electrical Engineering, University of California, Riverside, California 92521
Zonglin Li
Affiliation:
Department of Electrical Engineering, University of California, Riverside, California 92521
Jian Huang
Affiliation:
Department of Electrical Engineering, University of California, Riverside, California 92521
Jianlin Liu
Affiliation:
Department of Electrical Engineering, University of California, Riverside, California 92521
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Abstract

Metal/high-k dielectric core-shell nanocrystal (NC) memory capacitors were demonstrated by e-beam evaporation process. This kind of metal oxide semiconductor (MOS) memory shows good performance in charge storage, programming and erasing speeds. Compared to Co NC memory, Co/Al2O3 core-shell NC memory shows improved retention performance since the additional Al2O3 shell layer acts as a barrier, which prevent the leakage.

Type
Articles
Copyright
Copyright © Materials Research Society 2012

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References

REFERENCES

1. Oh Chang, W., Sung, H. K., Na, Y. K., Yong, L. C., Yong, S. L., Won, J. J., Hyo, S. L., Heung, S. P., Kim, D. W., Park, D., Ryu, B., VLSI Symp. Tech. Dig., 58 (2006)Google Scholar
2. Chang, Ting-Chang, Jiana, Fu-Yen, Chen, Shih-Cheng, and Tsai, Yu-Ting, Materialstoday 8 808 (2011)Google Scholar
3. Dimitrakis, P, Kapetanakis, E, Tsoukalas, D, Skarlatos, D, Bonafos, C, Ben Asssayag, G, Claverie, A, Perego, M, Fanciulli, M, Soncini, V, Sotgiu, R, Agarwal, A, Ameen, M, Sohl, C, Normand, P, Solid-State Electronics 48 1511(2004)Google Scholar
4. Lee, P F, Lu, X B, Dai, J Y, Chan, H L W, Jelenkovic, Emil and Tong, K Y, Nanotechnology 17 1202 (2006)Google Scholar
5. Ma, X. Wan, C., Appl. Phys. B: Lasers and Optics 92 589 (2008)Google Scholar
6. Leu, Ching-Chich, Chen, Shih-Tang, Liu, Fu-Ken, Thin Solid Films 519 5629 (2011)Google Scholar
7. Liu, Zengtao, Lee, Chungho, Narayanan, Venkat, Pei, Gen, Student Member and Kan, Edwin C., IEEE Electron Device Letters 24 345 (2003)Google Scholar
8. Liu, Zengtao, Lee, Chungho, Narayanan, Venkat, Pei, Gen, and Chihchuan Kan, Edwin, IEEE Trans. Electron Devices 49 1614 (2002)Google Scholar
9. Chen, Wei-Ren, Chang, Ting-Chang, Tsun Liu, Po, Sun Lin, Po, Tu, Chun-Hao, and Chang, Chun Yen, Appl. Phys. Lett. 90 112108 (2007)Google Scholar
10. Lee, Dong Uk, Kim, Seon Pil, Han, Dong Seok, Lee, Hyo Jun, Kim, Eun Kyu, You, Hee Wook, Cho, Won Ju, Journal of Nanoscience and Nanotechnology 11, 9181 (2011)Google Scholar
11. Zhu, Y., and Liu, J. L., IEEE Transactions on Nanotechnology 7 305 (2008)Google Scholar
12. Maikap, S., Tzeng, P.J., Lin, C.H., Wang, T. Y., Lee, H.Y., Tzeng, S. S., Wang, C.C., Tien, T.C., Lee, L. S., Li, P. W., Yang, J. R., Tsai, M. J., International Journal of Nanomanufacturing 2 407 (2008)Google Scholar
13. Hou, T. H., Lee, C., Narayanan, V., Ganguly, U., and Kan, E. C., IEEE Trans. Electron Devices 53 12 (2006)Google Scholar
14. Zhou, Huimei, Gann, Reuben, Li, Bei, Liu, Jianlin and Yarmoff, J. A., Mater. Res. Soc. Symp. Proc. 1160 1160–H01–05 (2009)Google Scholar
15. Zhou, Huimei, Li, Bei, Yang, Zheng, Zhan, Ning, Yan, Dong, Lake, Roger K., and Liu, Jianlin, IEEE Trans. Nanotechnol. 10 499 (2011)Google Scholar
16. Lee, J. J., Harada, Y., Pyun, J. W., and Kwong, D. L., Appl. Phys. Lett. 86 103505 (2005)Google Scholar
17. Zhou, Huimei, Dorman, James A., Perng, Ya-Chuan, Gachot, Stephanie, Zheng, Jian-Guo, Chang, Jane P. and Liu, Jianlin, Appl. Phys. Lett. 98 192107 (2011)Google Scholar
18. Zhou, Huimei, Dorman, James A., Perng, Ya-Chuan, Gachot, Stephanie, Huang, Jian, Mao, Yuanbing, Chang, Jane P. and Liu, Jianlin, Mater. Res. Soc. Symp. Proc. 1250 1250–G01-09 (2010)Google Scholar