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Bismuth Pyrochlore Films for Dielectric Applications

Published online by Cambridge University Press:  10 February 2011

Wei Ren ,
Ryan Thayer ,
Clive A. Randall ,
Thomas R. Shrout  and
Susan Trolier-McKinstry
Wei Ren
Affiliation:
Materials Research Laboratory, Pennsylvania State University, University Park, PA 16802-4801
Ryan Thayer
Affiliation:
Materials Research Laboratory, Pennsylvania State University, University Park, PA 16802-4801
Clive A. Randall
Affiliation:
Materials Research Laboratory, Pennsylvania State University, University Park, PA 16802-4801
Thomas R. Shrout
Affiliation:
Materials Research Laboratory, Pennsylvania State University, University Park, PA 16802-4801
Susan Trolier-McKinstry
Affiliation:
Materials Research Laboratory, Pennsylvania State University, University Park, PA 16802-4801
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Abstract

Bismuth pyrochlore ceramics have modest temperature coefficients of capacitance, good microwave properties, and can be prepared at relatively modest temperatures (∼900 – 1100 °C). This work focuses on the preparation and characterization of thin films in this family for the first time. A sol-gel procedure using bismuth acetate in acetic acid and pyridine, in combination with zinc acetate dihydrate and niobium ethoxide in 2-methoxyethanol was developed. The solution chemistry was adjusted to prepare (Bi1.5Zn0.5)(Zn0.5Nb1.5)O7 and Bi2(Zn1/3Nb2/3)2O7 films. Solutions were spin-coated onto platinized Si substrates and crystallized by rapid thermal annealing. In both cases, crystallization occurred by 550 °C into the cubic pyrochlore structure. (Bi1.5Zn0.5)(Zn0.5Nb1.5)O7 films remained in the cubic phase up to crystallization temperatures of 750 °C, while the structure of the Bi2(Zn1/3Nb2/3)2O7 thin films is dependent of the firing temperature: cubic below 650 °C and orthorhombic above 750 °C. A mixture of cubic and orthorhombic structures is found at 700 °C. The resulting BZN films are dense, uniform, and smooth (rms roughness of < 5 nm). Cubic bismuth zinc niobate films show dielectric constants up to 150, a negative temperature coefficient of capacitance, TCC, (∼ - 400 ppm/°C), tan δ < 0.01, and a field tunable dielectric constant. Orthorhombic films showed smaller dielectric constants (∼80), low tan δ (< 0.01), positive TCC, and field independent dielectric constants. TCC could be adjusted to new 0 ppm/°C using a mixture of orthorhombic and cubic material.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 603: Symposium KK – Materials Issues for Tunable RF & Microwave Devices , 1999 , 137
Copyright
Copyright © Materials Research Society 2000

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