Hostname: page-component-848d4c4894-x24gv Total loading time: 0 Render date: 2024-05-12T12:38:01.732Z Has data issue: false hasContentIssue false
  • English
  • Français

Analysis of Local Planarization with Polishing Time, Film Thickness, Chemical Non-Uniformity, Line Density, Line Width, and Pad Relaxation Property

Published online by Cambridge University Press:  01 February 2011

Jinru Bian  and
John Quanci
Jinru Bian
Affiliation:
Rodel Inc.
John Quanci
Affiliation:
Rodel Inc.
Get access

Abstract

Theoretical chemical mechanical polishing local planarization models as a function of polishing time and film removal are reviewed, and re-derived in a systematic and correlative way. The derived models employ pad viscoelastic and relaxation properties to explain the experimental phenomena that step height local planarization is an exponential function of line width at the same line density, and also account for the affect of pattern density and polishing of two different materials at the same time on step height planarization.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 732: Symposium I – Chemical-Mechanical Planarization , 2002 , I5.5
Copyright
Copyright © Materials Research Society 2002

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1. Burke, P.A., Proc. VMIC Conf. pp 379–384, Santa Clara, CA, June 1991.Google Scholar
2. Tseng, E., Yi, C. and Chen, H.C., CMP-MIC, pp 258–265, Santa Clara, CA, Feb. 1997.Google Scholar
3. Stine, B., Ouma, D., Divecha, R., Boning, D., Chung, J., Hetherington, D., Ali, I., Shinn, G., Clark, J., Nakagawa, O.S., Oh, S.-Y., CMP-MIC, pp 266 Santa Clara 1997.Google Scholar
4. Grillaret, J., Meuris, M., Heylen, N., Devriendt, K., Virancken, E., Heyns, M., RMS 1998 Spring Meeting, San Francisco, CA May 1998.Google Scholar
5. Grillaret, J., Meuris, M., Virancken, E., Heylen, N., Devriendt, K., Fyenen, W., Heyns, M., CMP-MIC, pp 105, Feb. 1999 Google Scholar
6. Tseng, E. et al., VMIC Conf. Proc. pp360, 1997 Google Scholar
7. Smith, T.H., Fang, S.J., Boning, D.S., Shinn, G.B. and Stegani, J.A. CMP-MIC Conf. pp97, Feb. 1999.Google Scholar
8. Aklonis, J.J., MacKnight, W.J., Shen, M., “Introduction to Polymer Viscoelasticity” Wiley-Interscience, New York, 1972.Google Scholar