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Dielectric Properties Of Low Dielectric Constant Polymeric Materials

Published online by Cambridge University Press:  15 February 2011

Flora S. Ip  and
Chiu Ting
Flora S. Ip
Affiliation:
SEMATECH 2706 Montopolis Dr., Austin TX 78741 On Assignment from Advanced Micro Devices, Austin, TX
Chiu Ting
Affiliation:
SEMATECH 2706 Montopolis Dr., Austin TX 78741 On Assignment from Intel Corp., Santa Clara, CA
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Abstract

Multilevel interconnects for high performance ULSI need low dielectric constant materials for inter-metal layer dielectric, or ILD, to reduce signal propagation delay, power consumption and cross talk noises. We have studied the physical, dielectric and processing properties of a wide variety of promising low dielectric polymeric materials for ILD applications. This paper presents capacitance values measured over a wide range of temperature, and a summary of the measured dielectric properties. The anisotropy 1,2 of dielectric properties were determined experimentally, the vertical (out-of-plane) dielectric properties were determined by MIM (Metal-Insulator-Metal) measurements, and the horizontal (in-plane) dielectric properties were determined by intra-line measurements of sub-half micron serpentine and comb test structures.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 381: Symposium F – Low-Dielectric Constant Materials--Synthesis and Applications in Micro. , 1995 , 135
Copyright
Copyright © Materials Research Society 1995

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References

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