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Spatial Profile of Thermoelectric Effects During Peltier Pulsing in Bi and Bi/MnBi Eutectic

Published online by Cambridge University Press:  26 February 2011

R. P. Silberstein  and
D. J. Larson Jr
R. P. Silberstein
Affiliation:
Grumman Corporate Research Center, M/S A01-26, Bethpage, NY 11714-3580
D. J. Larson Jr
Affiliation:
Grumman Corporate Research Center, M/S A01-26, Bethpage, NY 11714-3580
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Abstract

We have studied the spatial profile of the thermal transients that occur during and following the current pulsing associated with Peltier Interface Demarcation during directional solidification. Results for pure Bi are presented in detail and compared with corresponding results for the Bi/MnBi eutectic. Significant thermal transients occur throughout the sample that can be accounted for by the Peltier effect, the Thomson effect, and Joule heating. We have separated these effects and studied their behavior as a function of time, current density, and position with respect to the solid/liquid interface.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 87: Symposium O – Materials Processing in the Reduced Gravity Environment of Space , 1986 , 129
Copyright
Copyright © Materials Research Society 1987

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References

1. Gatos, H., Witt, A., Lichtensteiger, M., and Herman, C., ASTP Summary Science Report Vol 1, NASA, Washington, DC (1977).Google Scholar
2. Fu, T., Wilcox, W., and Larson, D. Jr., J. Crystal Growth 57, 189 (1982).Google Scholar
3. Larson, D. Jr., Pirich, R., Busch, G., Wilcox, W., Ghias, I., and Fu, T., Research and Development Center Report RM-707, Grumman Corporate Research Center, Bethpage, NY, May (1980).Google Scholar
4. Schaefer, R., and Glicksman, M., Acta Metall. 16, 1009 (1968).Google Scholar
5. Silberstein, R., Larson, D. Jr., and Dressler, B., Metall. Trans. A 15A, 2147 (1984).Google Scholar
6. Barnard, R., Thermoelectricity in Metals and Alloys, New York, John Wiley & Sons, Chap 1, (1972).Google Scholar
7. Pirich, R., Metall. Trans A, 15A, 2139 (1984).Google Scholar
8. Pirich, R., Busch, G., Poit, W., and Larson, D. Jr., Metall. Trans. A, 11A, 193 (1980).Google Scholar
9. Pirich, R., Larson, D. Jr., Wilcox, W., Fu, T., Ravishankar, R., Ramarao, B., Nair, M., and Doddi, K., Research and Development Center Report RE-649, Grumman Corporate Research Center, Bethpage, NY (Jan. 1983).Google Scholar
10. Pirich, R., Corporate Research Center Report RE-642, Grumman Corporate Research Center, Bethpage, NY (June 1982).Google Scholar
11. Bardeen, J., and Chandrasekhar, B., J. Appl. Phys. 29, 1372 (1958).Google Scholar
12. Smithells, C., ed. Metals Reference Book, 5th ed., Boston, Butterworths, pp 940–948 (1976).Google Scholar