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Fabrication of Sequential Nanostripes by Controlled Electrodeposition

Published online by Cambridge University Press:  11 February 2011

M. Mikhaylova ,
D. K. Kim ,
M. Toprak  and
M. Muhammed
M. Mikhaylova
Affiliation:
Materials Chemistry Division, Royal Institute of Technology, SE 10044, Stockholm, Sweden
D. K. Kim
Affiliation:
Materials Chemistry Division, Royal Institute of Technology, SE 10044, Stockholm, Sweden
M. Toprak
Affiliation:
Materials Chemistry Division, Royal Institute of Technology, SE 10044, Stockholm, Sweden
M. Muhammed
Affiliation:
Materials Chemistry Division, Royal Institute of Technology, SE 10044, Stockholm, Sweden
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Abstract

Au nanowires and sequential metal nanostripes were prepared by AC pulse electrodeposition in anodic alumina membrane (AAM). Due to the high toxicity of cyanide-based electrolytes, which commonly used for electrodeposition of noble metals, new types of Au electroplating solution has been introduced. Electroplating solutions of noble metals Au, Ag and Pt were alternately used for nanostripes fabrication. The AAM was prepared by a two-step electrochemical anodization process in oxalic acid. The pore size was controlled by varying anodizing voltage and current density. The AAM was investigated by SEM and AFM. The results show hexagonally ordered channels with a pore diameter 50 nm. The morphology and composition of nanowires and nanostripes were examined by TEM and optical microscopes, which show uniformly, ordered Au nanowires with a length about 250 nm and a diameter about 50 nm. Au-Ag-Au-Pt-Au sequential nanostripes have a length about 3.5 μm and diameter 50 nm has been successfully prepared.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 750: Symposium Y – Surface Engineering 2002–Synthesis, Characterization and Applications , 2002 , Y2.7
Copyright
Copyright © Materials Research Society 2003

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References

REFERENCE

1. Asoh, H., Nishio, K., Nakao, M., Yokoo, A., Tamamura, T. and Masuda, H., J. Vac. Sci. Technol., B 19 (2), 569 (2001).Google Scholar
2. Ying, J. Y., Zhang, Z., Zhang, L., Dresselhaus, M. S., US Patent, Nanowire arrays, 6, 359, 288 B1.Google Scholar
3. Valizadeh, S., Electrodeposition of Ag/Co and Au/Co compositionally modulated thin films and nanowires arrays, PhD Thesis, Dissertation No. 685, Dep. Phys. Measurem. Tech., Linköping University, (2001).Google Scholar
4. Li, A. P., Muller, F., Birner, A., Nielsch, K. and Gösele, U., J. Appl. Phys. 84 (11), 6023, (1998).Google Scholar
5. Shimizu, K., Habazaki, H., Skeldon, P., Thompson, G. E. and Wood, G. C., Electrochem. Acta, 46, 4379, (2001).Google Scholar
6. Nielsch, K., Choi, J., Schwirn, K., Wehrspohn, R. B. and Gösele, U., Nano Letters, 2, (7), 677, (2002).Google Scholar
7. Muller, F., Muller, A. D., Kroll, M., Schmid, G., Appl. Surf. Sci., 171, (125–129), 125, (2001)Google Scholar
8. Li, F., Metzger, R., Doyle, W. D., IEEE Trans. Magn., 33, (5), 3715, (1997)Google Scholar
9. Mozalev, A., Magaino, S., Imai, H., Electrochem. Acta, 46, 2825, (2001).Google Scholar
10. Paulus, P. M., Luis, F., Kröll, M., Schmid, G., de Jongh, L.J., J. of Magn. And Magn. Mater. 224, 180, (2001).Google Scholar
11. Neilsch, K., Wehrspohn, R.B., Fischer, S.F., Kronmuller, H., Barthel, J., Kirschner, J. and Gosele, U., J. Mater. Res. 636, D1.9.1, (2001).Google Scholar
12. Nicewarner-Rena, S. R., Freeman, R. G., Reiss, B.D., He, L., Rena, D. J., Walton, I.D., Cromer, R., Keating, C.D., Natan, M. J., Science, 294, 137, (2001).Google Scholar
13. Zhou, H., Roy, S., Schulman, H. and Natan, M. J., TRENDS in Biotechnology, 19, S34, (2001).Google Scholar
14. Mikhaylova, M., Toprak, M., Kim, D. K., Zhang, Y., Muhammed, M., Mater. Res. Soc. Proc., 704, 155, (2002).Google Scholar