Hostname: page-component-76fb5796d-dfsvx Total loading time: 0 Render date: 2024-04-26T06:36:37.833Z Has data issue: false hasContentIssue false
  • English
  • Français

Microstructure and Composition of Au-Sn Eutectic Solder Electroplated from a Single Solution

Published online by Cambridge University Press:  26 February 2011

G. H. Jeong ,
J. H. Kim ,
Duhyun Lee  and
S. J. Suh
G. H. Jeong
Affiliation:
skk94@skku.edu, Sungkyunkwan University, Dept. of Advanced materials Eng., 300, Chunchun-dong, Suwon, Kyung-Ki-do, 440-746, Korea, Republic of
J. H. Kim
Affiliation:
saw999@skku.edu
Duhyun Lee
Affiliation:
duhyun@skku.edu
S. J. Suh
Affiliation:
suhsj@skku.ac.kr
Get access

Abstract

In this study, we produced Au-Sn alloy electroplated from a single solution and optimized the composition. The composition of electroplated Au-Sn alloy was Au-31.02 at.% Sn at the condition of 6 ms on - 4 ms off pulse current, 50 °C and 10 mA/cm2. Results in XRD analysis showed that Au-Sn alloy electroplated at DC 10 mA/cm2 had AuSn phase (δ) only and Au5Sn phase (d) appeared with decreasing the pulsed current on time. Also micro-patterned Au-Sn solder bump was produced by photolithography. Though it’s composition of Au-35.98 at.% Sn was not optimum, we tried to bond between Au-Sn solder bump and Si wafer that was coated with Ti (100 nm)/Au (300 nm).

Keywords

electrodepositionAuSn
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 894: Symposium LL – Combinatorial Methods and Informatics in Materials Science , 2005 , 0894-LL03-16
Copyright
Copyright © Materials Research Society 2006

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

[1] Kallmayer, C., Lin, D., Kloeser, J., Oppermann, H., Zakel, E., Reichl, H., IEEE/CPMT International Electronics Manufacturing Technology Symposium, 1995, 20 Google Scholar
[2] Kallmayer, C., Lin, D., Oppermann, H., Kloeser, J., Weib, S., Zakel, E., H. Reichl Proceeding of 10th European Microelectronics Conference, 1995, 440 Google Scholar
[3], Zakel, E., Reichl, H., in : Lau, J.(Ed.), Flip-Clip Technologies (ch.15), McGraw-Hill, 1995, 415 Google Scholar
[4] Merritt, S.A., Heim, P.J.S., Cho, SH. and Dagenais, M., IEEE Transactions on Components, Packing and Manufacturing Technology- Part B 20 (1997) 141 Google Scholar
[5] Doesburg, J., Ivey, D.G., Plating Surface Finishing 88 (2001) 78–83 Google Scholar
[6] Sun, W., Ivey, D.G., Electron., J. Mat. 30 (9) (1999) 111–122 Google Scholar
[7] Djurfors, B., Ivey, D.G., Electron., J. Mater. 30 (9) (2001) 1249–1254 Google Scholar
[8] Djurfors, B., Ivey, D.G., Mater. Sci. Eng. B90 (2002) 309–320 Google Scholar
[9] Matijasetiv, G., Lee, C. C., Electron., J. Mater. 18 (1989) 327–337 Google Scholar
[10] Goran, Matijasetiv, S., , Chin Lee, C., Wang, Chen Y., Thin Solid Films 223 (1993), 276–287 Google Scholar