Hostname: page-component-848d4c4894-hfldf Total loading time: 0 Render date: 2024-05-13T00:47:42.454Z Has data issue: false hasContentIssue false
  • English
  • Français

Co-firing of Low- and Middle Permittivity Dielectric Tapes in Low-Temperature Co-fired Ceramics

Published online by Cambridge University Press:  01 February 2011

Jae-Hwan Park ,
Young-Jin Choi  and
Jae-Gwan Park
Jae-Hwan Park
Affiliation:
Materials Science and Technology Division, Korea Institute of Science and Technology, PO Box 131, Cheongryang, Seoul 130-650, Korea
Young-Jin Choi
Affiliation:
Materials Science and Technology Division, Korea Institute of Science and Technology, PO Box 131, Cheongryang, Seoul 130-650, Korea
Jae-Gwan Park
Affiliation:
Materials Science and Technology Division, Korea Institute of Science and Technology, PO Box 131, Cheongryang, Seoul 130-650, Korea
Get access

Abstract

Compatibility in cofiring low-κ and middle-κ based on a same glass composition for the hybrid LTCC material systems was investigated. Designing of appropriate lithium borosilicate glass frit systems allowed us to develop an optimized glass frit system used for low-κ and middle-κ dielectric fillers, commonly. The effects of glass addition on the densification and electrical properties in low-κ and middle-κ dielectric materials were also examined. Controlling glass compositions and contents we tried to match low-κ and middle-κ tapes physically and chemically.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 869: Symposium D – Materials, Integration and Technology for Monolithic Instruments , 2005 , D2.7
Copyright
Copyright © Materials Research Society 2005

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1 Tummala, R. R., J. Am. Ceram. Soc., 74, 895 (1991).Google Scholar
2 Müller, J., Thust, H., and Drüe, K. H., International Journal of Microcircuits and Electronic Packaging, 18, 200 (1995).Google Scholar
3 Jantunen, H., Rautioaho, R., Uusimaki, A., and Leppavuori, S., J. Am. Ceram. Soc., 83, 2855 (2000).Google Scholar
4 Takada, T., Wang, S. F., Yoshikawa, S., Jang, S.-J., and Newnham, R. E., J. Am. Ceram Soc., 77, 2485 (1994).Google Scholar
5 Masse, D. J., Purcel, R. A., Readey, D. W., Maguire, E. A., and Hartwig, C. P., Proc. IEEE, 59, 1628 (2001).Google Scholar
6 Yang, C. F., Jpn. J. Appl. Phys., 38, 3576 (2001).Google Scholar
7 Hakki, B. W. and Coleman, P. D., IRE Microwave Theor. Tech., MTT-8, 402 (1991).Google Scholar