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Isothermal Fatigue of 62Sn–36Pb–2Ag Solder

Published online by Cambridge University Press:  26 February 2011

Semyon Vaynhan  and
Morris E. Fine
Semyon Vaynhan
Affiliation:
Basic Industry Research Laboratory and Department of Materials Science and Engineering, Northwestern University, Evanston, IL 60208
Morris E. Fine
Affiliation:
Department of Materials Science and Engineering, Northwestern University, Evanston, IL 60208
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Abstract

This paper discusses the effects of the most important variables during isothermal fatigue such as strain range, ramp time, tensile and compressive hold times, and temperature on fatigue life of near–eutectic 62Sn–36Pb–2Ag solder at strain ranges below 3.0%. The Coffin-Manson relation does not hold for 62Sn–36Pb–2Ag solder below 1% strain range. Decreasing frequency below 10-2 in no-hold tests reduces the number of cycles to failure. Tensile hold time or compressive hold time alone in the cycle dramatically reduce the number of cycles to failure. Increase of hold time over a few minutes leads to saturation of Nf. Combined tensile and compressive hold times affect the fatigue life of this solder less than either tensile or compressive hold alone. The effect of hold times on fatigue life is much stronger than the effect of ramp time. Practically no ramp time effect was observed in tests with tensile hold times. Very little effect of temperature over the range 25 to 80°C on fatigue life of 62Sn–36Pb–2Ag solder was observed when tested at total strain range of 1%.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 226: Symposium H – Mechanical Behavior of Materials and Structures in Microelectronics , 1991 , 3
Copyright
Copyright © Materials Research Society 1991

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