State-of-the-art ICs for microprocessors routinely dissipate power densities
on the order of 50 W/cm2. This large power is due to the
localized heating of ICs operating at high frequencies, and must be managed
for future high-frequency microelectronic applications. Our approach
involves finding new and efficient thermally conductive materials.
Exploiting carbon nanotube (CNT) films and composites for their superior
axial thermal conductance properties has the potential for such an
application requiring efficient heat transfer. In this work, we present
thermal contact resistance measurement results for CNT and CNT-Cu composite
films. It is shown that Cu-filled CNT arrays enhance thermal conductance
when compared to as-grown CNT arrays. Furthermore, the CNT-Cu composite
material provides a mechanically robust alternative to current IC packaging
technology.