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6 - LCP for passive components
- Anh-Vu H. Pham, University of California, Davis, Morgan J. Chen, Kunia Aihara
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- Book:
- LCP for Microwave Packages and Modules
- Published online:
- 05 July 2012
- Print publication:
- 21 June 2012, pp 160-192
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Summary
It has become increasingly apparent that LCP provides an ideal form, fit, and function for many broadband passive components. Since LCP is available in thicknesses less than 1 mil with low dielectric constant, this enables easy design of varying controlled impedances. Further, LCP’s property of being its own adhesive layer provides for a high layer count in a multilayer stack while simultaneously maintaining high-frequency performance that otherwise would be detuned by poor electrical ply layers. This chapter provides design and development examples of broadband passives that benefit from LCP. In section 6.1 we describe a broadband Marchand balun implemented on multilayer LCP covering 4–20 GHz and in section 6.2 a broadband Wilkinson power divider–combiner operating over 2–18 GHz. Section 6.3 presents a novel hybrid coupler using multilayer LCP to achieve a broadband design within a compact area.
Broadband LCP Marchand balun
A balun converts differential “balanced” signals into single-ended “unbalanced” signals, and vice versa. Marchand baluns are found in numerous microwave circuit designs owing to their characteristically wide bandwidth, low imbalance, and symmetric balanced ports. To achieve a wide bandwidth ratio, a Marchand balun is realized with multilayered broadside coupled microstrip lines implemented on LCP. A novel twin-thickness thin-film [1] structure has been devised specifically to reduce balun conduction loss without sacrificing operation bandwidth.
7 - LCP for system design
- Anh-Vu H. Pham, University of California, Davis, Morgan J. Chen, Kunia Aihara
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- Book:
- LCP for Microwave Packages and Modules
- Published online:
- 05 July 2012
- Print publication:
- 21 June 2012, pp 193-225
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- Chapter
- Export citation
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Summary
This chapter presents a number of subsystem-level modules that benefit from an LCP implementation. The first module, in section 7.1, is a long time delay (LTD) circuit with amplitude compensation. This module demonstrates the advantages of homogenous dielectric core and ply layers in a multilayer build. Known analytic solutions for transmission lines may be readily applied for first-pass success. In addition, the homogenous multilayer build achieves amplitude compensation through novel LCP transmission line implementations. Lastly, this module demonstrates LCP’s surface mount (SMT) component compatibility with commercially available MEMS switches.
The second module, in section 7.2, is a push–pull amplifier. This module demonstrates how LCP’s multilayer construction easily allows minimally short bondwires for high-performance chip interconnect. Further, this module integrates high-performance LCP baluns to achieve excellent even-mode distortion cancellation. This module also demonstrates how LCP lends itself naturally to the higher-level integration of LCP-enhanced passives.
Lastly, a receiver module with a built-in phased-array antenna is described in section 7.3 . In this receiver module , LCP is demonstrated to provide a convenient platform for mechanically flexible electronics. Passive antenna structures are designed directly into the LCP build. Active semiconductor chips are packaged into this platform to show how LCP is ideally suited for building up large systems.
Each module represents advanced research based on an LCP platform that extends the electrical performance and mechanical functionality of today’s subsystem modules.