2 results
Evaluating Oxide Liner and Copper Barrier Integrity of Through-Silicon-Via by Electrical Characterization and Microanalysis
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- Journal:
- MRS Online Proceedings Library Archive / Volume 1559 / 2013
- Published online by Cambridge University Press:
- 05 June 2013, mrss13-1559-aa08-04
- Print publication:
- 2013
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- Article
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Material, Process and Geometry Effects on Through-Silicon Via Reliability and Isolation
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- Journal:
- MRS Online Proceedings Library Archive / Volume 1249 / 2010
- Published online by Cambridge University Press:
- 01 February 2011, 1249-F09-08
- Print publication:
- 2010
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- Article
- Export citation