A binary Sn-5wt.%Sb solder alloy was chosen as a potential alternative to
Sn-Pb solder alloy to be subjected to many studies. It was casted from the
liquid state, cold drawn into wires of 1 mm diameters. The study includes
the structure, electrical resistivity, tensile strength, hardness and
indentation creep behavior using XRD, four probes electrical circuit,
conventional tensile testing machine, Vickers microhardness tester,
respectively. These properties were carried out for the cold worked alloy
and after annealing at 393 and 473 K for 60 min. It was found that annealed
samples exhibit more precipitations of the intermetallic compounds SnSb,
higher lattice parameters and higher crystallite size, while have lower
lattice-strain induced due to the cold working process. These structural
changes greatly affect the electrical resistivity and mechanical properties
of this alloy.