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Spalling of intermetallic compounds during the reaction between lead-free solders and electroless Ni-P metallization

Published online by Cambridge University Press:  03 March 2011

Y.C. Sohn ,
Jin Yu ,
S.K. Kang ,
D.Y. Shih  and
T.Y. Lee
Y.C. Sohn*
Affiliation:
Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology, 373-1 Guseong-Dong, Yuseong-Gu, Daejeon 305-701, Korea
Jin Yu
Affiliation:
Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology, 373-1 Guseong-Dong, Yuseong-Gu, Daejeon 305-701, Korea
S.K. Kang
Affiliation:
IBM T.J. Watson Research Center, P.O. Box 218/Route 134, Yorktown Heights, New York 10598
D.Y. Shih
Affiliation:
IBM T.J. Watson Research Center, P.O. Box 218/Route 134, Yorktown Heights, New York 10598
T.Y. Lee
Affiliation:
Department of Materials Science and Engineering, Hanbat National University, San 16-1, DukMyoung-Dong, Yuseong-Gu, Deajeon 305-764, Korea
*
a)Address all correspondence to this author.e-mail: sonyc@kaist.ac.kr
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Abstract

Intermetallic compound (IMC) spalling from electroless Ni-P film was investigated with lead-free solders in terms of solder-deposition methods (electroplating, solder paste, and thin foil), P content in the Ni-P film (4.6, 9, and 13 wt% P), and solder thickness (120 versus .200 μm). The reaction of Ni-P with Sn3.5Ag paste easily led to IMC spalling after 2-min reflow at 250 °C while IMCs adhered to the Ni-P layer after 10-min reflow with electroplated Sn or Sn3.5Ag. It has been shown that not only the solder composition but also the deposition method is important for IMC spalling from the Ni-P layer. The spalling increased with P content as well as with solder volume. Ni3Sn4 intermetallics formed as a needle-shaped morphology at an early stage and changed into a chunk-shape. Needle-shaped compounds exhibited a higher propensity for spalling than chunk-shaped compounds because many channels among the needle-shaped IMCs facilitated Sn penetration. A reaction between the penetrated Sn and the Ni3P layer formed a Ni3SnP layer and Ni3Sn4 IMCs spalled off the Ni3SnP surface. Dewetting of solder from the Ni3SnP layer, however, did not occur even after spalling of most IMCs.

Keywords

PlatingPackagingPaste

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Type
Articles
Information
Journal of Materials Research , Volume 19 , Issue 8 , August 2004 , pp. 2428 - 2436
Copyright
Copyright © Materials Research Society 2004

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