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Failure Analysis and Reliability of Low-Temperature-Grown Multi-Wall Carbon Nanotube Bundles Integrated as Vias in Monolithic Three-Dimensional Integrated Circuits
Published online by Cambridge University Press: 27 August 2014
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- Microscopy and Microanalysis , Volume 20 , Supplement S3: Proceedings of Microscopy & Microanalysis 2014 , August 2014 , pp. 1762 - 1763
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- Copyright © Microscopy Society of America 2014
References
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Vollebregt, S, et al., Proceedings of the 11th IEEE Conference on Nanotechnology (IEEE-NANO2011) p. 985.Google Scholar
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Vollebregt, S, et al., Proceedings of the 12th IEEE Conference on Nanotechnology (IEEE-NANO2012) p. 424.Google Scholar
[5] This work is a partial contribution of NIST, an agency of the U.S government, and therefore not subject to copyright in the United States.Google Scholar
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