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Failure Analysis and Reliability of Low-Temperature-Grown Multi-Wall Carbon Nanotube Bundles Integrated as Vias in Monolithic Three-Dimensional Integrated Circuits

Published online by Cambridge University Press:  27 August 2014

Ann N. Chiaramonti ,
Sten Vollebregt ,
Aric W. Sanders ,
Ryoichi Ishihara  and
David T. Read
Ann N. Chiaramonti
Affiliation:
Applied Chemicals and Materials Division, Material Measurement Laboratory, National Institute of Standards and Technology, Boulder, CO USA
Sten Vollebregt
Affiliation:
Department of Microelectronics, Delft University of Technology, Delft, The Netherlands
Aric W. Sanders
Affiliation:
Applied Chemicals and Materials Division, Material Measurement Laboratory, National Institute of Standards and Technology, Boulder, CO USA
Ryoichi Ishihara
Affiliation:
Department of Microelectronics, Delft University of Technology, Delft, The Netherlands
David T. Read
Affiliation:
Applied Chemicals and Materials Division, Material Measurement Laboratory, National Institute of Standards and Technology, Boulder, CO USA

Abstract

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Abstract
Information
Microscopy and Microanalysis , Volume 20 , Supplement S3: Proceedings of Microscopy & Microanalysis 2014 , August 2014 , pp. 1762 - 1763
Copyright
Copyright © Microscopy Society of America 2014 

References

[1] Vollebregt, S, et al., Japanese Journal of Applied Physics 52 (2013) p. 04CB0.Google Scholar
[2] Vollebregt, S, et al., Proceedings of the 11th IEEE Conference on Nanotechnology (IEEE-NANO2011) p. 985.Google Scholar
[3] Vollebregt, S, et al., Proceedings of the 12th IEEE Conference on Nanotechnology (IEEE-NANO2012) p. 424.Google Scholar
[4] Vollebregt, S, et al., IEEE Transactions on Electron Devices 60 (2013) p. 4085.Google Scholar
[5] This work is a partial contribution of NIST, an agency of the U.S government, and therefore not subject to copyright in the United States.Google Scholar