We shall review applications of electronic composites in this chapter, which is subdivided into four areas: electronic packaging, MEMS, composites for sensors and actuators, and control of electromagnetic waves.

Electronic packaging

Electronic composites have been used extensively for electronic packaging materials, which often have conflicting requirements that are difficult to meet – high thermal conductivity, low electrical conductivity, and low coefficient of thermal expansion (CTE). In addition, low density and low cost are normally required, particularly for commercial packaging applications. Thus polymer matrix composites are the most popular choice, while some military and space applications require the use of high-performance electronic composites, thus sometimes justifying the use of metal matrix composites and ceramic matrix composites. A detailed review of electronic packaging materials is summarized in a book by Chung (1995). Zweben (1995) made an extensive review of electronic composites for use in electronic packaging, which include all types of composites, polymer matrix composites (PMCs), metal matrix composites (MMCs), ceramic matrix composites (CMCs) and carbon/carbon (C/C) composites.

Applications of electronic composites are quite extensive, covering computers, appliances, generators, and transformers, to name a few. Depending on their physical functions, one can categorize them into several types – housing, insulator, resistor, and conductor – which are discussed below. It is to be noted here that the housing material can be an insulator, a conductor, or an electromagnetic wave absorber, depending on the specific application.