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Estimation of signal attenuation in the 60 GHZ band with an analog BiCMOS passive filter

Published online by Cambridge University Press:  17 July 2014

Johannes W. Lambrechts*
Affiliation:
Department of Electrical, Electronic and Computer Engineering, Carl and Emily Fuchs Institute for Microelectronics, University of Pretoria, Lynnwood Road, Pretoria, South Africa
Saurabh Sinha
Affiliation:
Department of Electrical, Electronic and Computer Engineering, Carl and Emily Fuchs Institute for Microelectronics, University of Pretoria, Lynnwood Road, Pretoria, South Africa Faculty of Engineering and the Built Environment, University of Johannesburg, Auckland Park, Johannesburg, South Africa
*
Corresponding author J.W. Lambrechts Email: wynand.lambrechts@ieee.org

Abstract

Prediction of millimeter(mm)-wave radio signals can be beneficial in recreating and repeating atmospheric conditions in a controlled, laboratory environment. A path-loss model has been proposed that accounts for free-space losses, oxygen absorption, reflection and diffraction losses, and rain-rate attenuation at mm-wave frequencies. Two variable passive low-pass-integrated circuit filter structures for attenuation in the 57–64 GHz unlicensed frequency band have been proposed, designed, simulated, prototyped in a 130-nm SiGe bipolar complementary metal-oxide semiconductor process, and measured. The filters are based on the Butterworth and Chebyshev low-pass filter topologies and investigate the possibility of using the structures to perform amplitude attenuation of mm-wave frequencies over a short distance. Both filters are designed and matched for direct coupling with equivalent circuit models of dipole antennas operating in this frequency band. Full integration therefore allows prediction of atmospheric losses on an analog, real-time, basis without the requirement of down-converting (sampling) to analyze high-frequency signals through a digital architecture. On-wafer probe measurements were performed to limit parasitic interference from bonding wires and enclosed packaging.

Type
Industrial and Engineering Paper
Copyright
Copyright © Cambridge University Press and the European Microwave Association 2014 

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