Skip to main content
    • Aa
    • Aa
  • Get access
    Check if you have access via personal or institutional login
  • Cited by 30
  • Cited by
    This article has been cited by the following publications. This list is generated based on data provided by CrossRef.

    Zahedmanesh, Houman Vanstreels, Kris and Gonzalez, Mario 2016. A numerical study on nano-indentation induced fracture of low dielectric constant brittle thin films using cube corner probes. Microelectronic Engineering, Vol. 156, p. 108.

    Favache, Audrey Sacré, Charles-Henry Coulombier, Michaël Libralesso, Laure Guaino, Philippe Raskin, Jean-Pierre Bailly, Christian Nysten, Bernard and Pardoen, Thomas 2015. Fracture mechanics based analysis of the scratch resistance of thin brittle coatings on a soft interlayer. Wear, Vol. 330-331, p. 461.

    Powell, C. Travis Chen, Yinshan and Yu, Lian 2015. Fracture of molecular glasses under tension and increasing their fracture resistance with polymer additives. Journal of Non-Crystalline Solids, Vol. 429, p. 122.

    Favache, Audrey Libralesso, Laure Jacques, Pascal J. Raskin, Jean-Pierre Bailly, Christian Nysten, Bernard and Pardoen, Thomas 2014. Fracture toughness measurement of ultra-thin hard films deposited on a polymer interlayer. Thin Solid Films, Vol. 550, p. 464.

    Alshehri, Omar Yavuz, Mustafa and Tsui, Ting 2013. Manifestation of external size reduction effects on the yield point of nanocrystalline rhodium using nanopillars approach. Acta Materialia, Vol. 61, Issue. 1, p. 40.

    Chang, Hsiao-Yu Yang, Shixuan Lee, Jongho Tao, Li Hwang, Wan-Sik Jena, Debdeep Lu, Nanshu and Akinwande, Deji 2013. High-Performance, Highly Bendable MoS2Transistors with High-K Dielectrics for Flexible Low-Power Systems. ACS Nano, Vol. 7, Issue. 6, p. 5446.

    Zhang, Wei Yang, Fut K. Han, Yougun Gaikwad, Ravi Leonenko, Zoya and Zhao, Boxin 2013. Surface and Tribological Behaviors of the Bioinspired Polydopamine Thin Films under Dry and Wet Conditions. Biomacromolecules, Vol. 14, Issue. 2, p. 394.

    Fan, X.L. Zhang, W.X. Wang, T.J. and Sun, Q. 2012. The effect of thermally grown oxide on multiple surface cracking in air plasma sprayed thermal barrier coating system. Surface and Coatings Technology, Vol. 208, p. 7.

    Jia, Zheng Tucker, Matthew B. and Li, Teng 2011. Failure mechanics of organic–inorganic multilayer permeation barriers in flexible electronics. Composites Science and Technology, Vol. 71, Issue. 3, p. 365.

    Jia, Zheng Tucker, Matthew B. and Li, Teng 2011. Concomitant Channel Cracking and Interfacial Delamination in Polymer/Oxide Nano Hybrid Permeation Barriers in Flexible Electronics. MRS Proceedings, Vol. 1312,

    Kim, Hong-Nam Lee, Sung-Hoon and Suh, Kahp-Yang 2011. Controlled mechanical fracture for fabricating microchannels with various size gradients. Lab Chip, Vol. 11, Issue. 4, p. 717.

    Peng, Cheng Jia, Zheng Bianculli, Dan Li, Teng and Lou, Jun 2011. In situ electro-mechanical experiments and mechanics modeling of tensile cracking in indium tin oxide thin films on polyimide substrates. Journal of Applied Physics, Vol. 109, Issue. 10, p. 103530.

    Reinhardt, Karen A. Reidy, Richard F. and Daviot, Jerome 2011. Handbook of Cleaning in Semiconductor Manufacturing.

    Wu, Zhuo-Jie Luo, Zhiquan Rastogia, Ashish Stavchansky, Salomon Bowman, Phillip D. and Ho, Paul S. 2011. Micro-fabricated perforated polymer devices for long-term drug delivery. Biomedical Microdevices, Vol. 13, Issue. 3, p. 485.

    Xu, W. Yang, J.S. and Lu, T.J. 2011. Ductility of thin copper films on rough polymer substrates. Materials & Design, Vol. 32, Issue. 1, p. 154.

    Karanikas, Christos F. Li, Han Vlassak, Joost J. and Watkins, James J. 2010. Quantitative Interfacial Energy Measurements of Adhesion-Promoted Thin Copper Films by Supercritical Fluid Deposition on Barrier Layers. Journal of Engineering Materials and Technology, Vol. 132, Issue. 2, p. 021014.

    Xu, W. Lu, T.J. and Wang, F. 2010. Effects of interfacial properties on the ductility of polymer-supported metal films for flexible electronics. International Journal of Solids and Structures, Vol. 47, Issue. 14-15, p. 1830.

    King, S.W. and Gradner, J.A. 2009. Intrinsic stress fracture energy measurements for PECVD thin films in the SiOxCyNz:H system. Microelectronics Reliability, Vol. 49, Issue. 7, p. 721.

    Fujikane, M. Nagao, S. Liu, X.W. Chrobak, D. Lehto, A. Yamanaka, S. and Nowak, R. 2008. Evaluation of carbon-doped low-k multilayer structure by nanoindentation. Journal of Alloys and Compounds, Vol. 448, Issue. 1-2, p. 293.

    Golovin, Yu. I. 2008. Nanoindentation and mechanical properties of solids in submicrovolumes, thin near-surface layers, and films: A Review. Physics of the Solid State, Vol. 50, Issue. 12, p. 2205.


Constraint Effects on Thin Film Channel Cracking Behavior

  • Ting Y. Tsui (a1), Andrew J. McKerrow (a1) and Joost J. Vlassak (a2)
  • DOI:
  • Published online: 01 March 2011

One of the most common forms of cohesive failure observed in brittle thin film subjected to a tensile residual stress is channel cracking, a fracture mode in which through-film cracks propagate in the film. The crack growth rate depends on intrinsic film properties, residual stress, the presence of reactive species in the environments, and the precise film stack. In this paper, we investigate the effect of various buffer layers sandwiched between a brittle carbon-doped-silicate (CDS) film and a silicon substrate on channel cracking of the CDS film. The results show that channel cracking is enhanced if the buffer layer is more compliant than the silicon substrate. Crack velocity increases with increasing buffer layer thickness and decreasing buffer layer stiffness. This is caused by a reduction of the constraint imposed by the substrate on the film and a commensurate increase in energy release rate. The degree of constraint is characterized experimentally as a function of buffer layer thickness and stiffness, and compared to the results of a simple shear lag model that was proposed previously. The results show that the shear lag model does not accurately predict the effect of the buffer layer.

Corresponding author
a) Address all correspondence to this author. e-mail: This paper was selected as the Outstanding Meeting Paper for the 2005 MRS Spring Meeting Symposium B Proceedings, Vol. 863.
Linked references
Hide All

This list contains references from the content that can be linked to their source. For a full set of references and notes please see the PDF or HTML where available.

3T.Y. Tsui , A.J. Griffin Jr., J. Jacques , R. Fields , A.J. McKerrow , and R. Kraft : Effects of elastic modulus on the fracture behavior of low-dielectric constant films, in Proceedings of the 2005 IEEE International Interconnect Technology Conference (IEEE Electronic Devices Society, Piscataway, NJ, 2005), pp. 6365.

4A.A. Volinsky , P. Waters , J.D. Kiely and E. Johns : Sub-critical telephone cord delamination propagation, in Stability of Thin Films and Nanostructures, edited by R.P. Vinci , R. Schwaiger , A. Karim , and V. Shenoy (Mater. Res. Soc. Symp. Proc. 854E, Warrendale, PA, 2004), U9.5.

6R.F. Cook and E.G. Liniger : Stress-corrosion cracking of low-dielectric-constant spin-on-glass thin films. J. Electrochem. Soc. 146, 4439 (1999).

7J.L. Beuth Jr.: Cracking of thin bonded films in residual tension. Int. J. Solids Struct. 29, 1657 (1992).

8J. Dundurs : Edge-bonded dissimilar orthogonal elastic wedges. J. Appl. Mech. 36, 650 (1969).

10S.M. Wiederhorn and H. Johnson : Effect of electrolyte pH on crack propagation in glass. J. Am. Ceram. Soc. 56(4), 192 (1973).

13J. He , G. Xu and Z. Suo Experimental determination of crack driving forces in integrated structures, in Proceedings of the 7th International Workshop on Stress-Induced Phenomena in Metallization, edited by P.S.W. Ho , S.P. Baker , T. Nakamura , and C.A. Volkert (American Institute of Physics, New York, 2004), pp. 314.

Recommend this journal

Email your librarian or administrator to recommend adding this journal to your organisation's collection.

Journal of Materials Research
  • ISSN: 0884-2914
  • EISSN: 2044-5326
  • URL: /core/journals/journal-of-materials-research
Please enter your name
Please enter a valid email address
Who would you like to send this to? *