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Direct writing of polymer thick film resistors using a novel laser transfer technique

Published online by Cambridge University Press:  31 January 2011

R. Modi ,
H. D. Wu ,
R. C. Y. Auyeung ,
C. M. Gilmore  and
D. B. Chrisey
R. Modi*
Affiliation:
Department of Mechanical and Aerospace Engineering, The George Washington University, Washington, DC 20052, and Naval Research Laboratory, Code 6372, Washington, DC 20052
H. D. Wu
Affiliation:
SFA, Inc., Largo, Maryland 20774 and Naval Research Laboratory, Code 6372, Washington, DC 20052
R. C. Y. Auyeung
Affiliation:
Naval Research Laboratory, Code 6372, Washington, DC 20052
C. M. Gilmore
Affiliation:
Department of Mechanical and Aerospace Engineering, The George Washington University, Washington, DC 20052, and Naval Research Laboratory, Code 6372, Washington, DC 20052
D. B. Chrisey
Affiliation:
Naval Research Laboratory, Code 6372, Washington, DC 20052
*
a) Address all correspondence to this author. e-mail: modi@ccs.nrl.navy.mil
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Abstract

Polymer thick film (PTF) resistors were fabricated using a new laser-based transfer technique called matrix-assisted pulsed laser evaporation direct write (MAPLE-DW). MAPLE-DW is a versatile direct writing technique capable of writing a wide variety of materials on virtually any substrate in air and at room temperature. Epoxy-based PTF resistors spanning four decades of sheet resistances (10 Ω/sq. to 100 kΩ/sq.) were deposited on alumina substrates under ambient conditions. Electrical characteristics of these MAPLE-DW deposited resistors were studied at a wide frequency range (1 MHz to 1.8 GHz), and the results were explained through an equivalent circuit model and impedance spectroscopy. Temperature coefficient of resistance measurements for the PTF resistors were performed between 25 and 125 °C. The results based on the percolation theory were used to explain the temperature dependence of the resistance behavior of the PTF resistors.

Type
Articles
Information
Journal of Materials Research , Volume 16 , Issue 11 , November 2001 , pp. 3214 - 3222
Copyright
Copyright © Materials Research Society 2001

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