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Effects of Cu and Ni additions to eutectic Pb–Sn solders on Au embrittlement of solder interconnections

Published online by Cambridge University Press:  31 January 2011

Jong-Hyun Lee ,
Jong-Hwan Park ,
Yong-Ho Lee  and
Yong-Seog Kim
Jong-Hyun Lee
Affiliation:
Department of Materials Science and Engineering, Hong Ik University, 72-1, Sangsu-Dong, Mapo-Gu, Seoul 121-791, Korea
Jong-Hwan Park
Affiliation:
Department of Materials Science and Engineering, Hong Ik University, 72-1, Sangsu-Dong, Mapo-Gu, Seoul 121-791, Korea
Yong-Ho Lee
Affiliation:
Department of Materials Science and Engineering, Hong Ik University, 72-1, Sangsu-Dong, Mapo-Gu, Seoul 121-791, Korea
Yong-Seog Kim
Affiliation:
Department of Materials Science and Engineering, Hong Ik University, 72-1, Sangsu-Dong, Mapo-Gu, Seoul 121-791, Korea
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Abstract

Effects Cu and Ni additions on Au embrittlement of eutectic Sn–Pb solder interconnections during a solid-state aging treatment were evaluated using a ball shear testing method. The addition resulted in a formation of Au-containing ternary intermetallic compounds, either Au–Sn–Cu or Au–Sn–Ni phase, inside the solder matrix during aging treatment. The fracture energy of the solder interconnection containing 2.9 wt% Cu remained almost the same up to 200 h of aging treatment at 150 °C, demonstrating the possibility of suppressing the Au embrittlement by forming ternary intermetallic phases inside the solder matrix.

Type
Rapid Communications
Information
Journal of Materials Research , Volume 16 , Issue 5 , May 2001 , pp. 1249 - 1251
Copyright
Copyright © Materials Research Society 2001

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References

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