Skip to main content
    • Aa
    • Aa

Electrochemical corrosion study of Sn–XAg–0.5Cu alloys in 3.5% NaCl solution

  • Udit Surya Mohanty (a1) and Kwang-Lung Lin (a1)

The electrochemical corrosion behavior of Sn–XAg–0.5Cu alloys in 3.5% NaCl solution was examined using potentiodynamic polarization techniques. The Ag content in the alloy was varied from 1 to 4 wt%. The polarization curves obtained for the alloys show an active–passive transition followed by a transpassive region. Sn–XAg–0.5Cu alloys with higher Ag content (>2 wt%) show a strong tendency toward passivation. The passivation behavior has been ascribed to the presence of both SnO and SnO2 on the anode surface. Increase in Ag content from 1 to 4 wt% results in a decrease in the corrosion-current density (Icorr) and linear polarization resistance (LPR) of the alloy. Nevertheless, the corrosion potential (Ecorr) shifts toward negative values, and a decrease in corrosion rate is observed. The presence of Cl ion initiates pitting and is responsible for the rupture of the passive layer at a certain breakdown potential. The breakdown potential (EBR) decreases and shifts toward more noble values with increase in Ag content in the alloy. Surface analyses by x-ray photoelectron spectroscopy (XPS) and Auger depth profile studies confirmed the formation of both Sn(II) and Sn(IV) oxides in the passive layer.

Corresponding author
a)Address all correspondence to this author. e-mail:
Linked references
Hide All

This list contains references from the content that can be linked to their source. For a full set of references and notes please see the PDF or HTML where available.

4 J.H. Kim , M.S. Suh H.S. Kwon : Effects of plating conditions on the microstructure of 80 Sn–20 Pb electrodeposits from an organic sulphonate bath. Surf. Coat. Technol. 78, 561996

5 Y. Liu M. Pritzker : Effect of pulse plating on composition of Sn–Pb coatings deposited in fluoroborate solutions. J. Appl. Electrochem. 33, 11432003

9 N. Kubota E. Sato : The properties of silver–tin alloy deposits from pyrophosphate bath. Electrochim. Acta. 30, 3051985

10 S. Arai , H. Akatsuka N. Kaneko : Sn–Ag solder bump formation for flip-chip bonding by electroplating. J. Electrochem. Soc. 150, 102003

12 S. Arai T. Watanabe : Microstructure of Sn–Ag alloys electrodeposited from pyrophosphate-iodide solutions. Mater. Trans. 39, 4391998

14 R.K. Shiue , L.W. Tsay , C.L. Lin J.L. Ou : A Study of Sn– Bi–Ag–In lead-free solders. J. Mater. Sci. 38, 12692003

15 E. Guaus J. Torrent-Burgues : Tin–zinc electrodeposition from sulphate–gluconate baths. J. Electroanal. Chem. 549, 252003

16 C.M.L. Wu , D.Q. Yu , C.M.T. Law L. Wang : The properties of Sn–9Zn lead free solder alloys doped with trace rare earth elements. J. Electron. Mater. 31, 9212002

19 M. Fukuda , K. Imayoshi Y. Matsumoto : Effects of thiourea and polyoxyethylene lauryl ether on electrodeposition of Sn–Ag–Cu alloy as a Pb free solder. J. Electrochem. Soc. 149, C2442002

21 T.M. Korhonen J.K. Kivilahti : Thermodynamics of the Sn–In–Ag solder system. J. Electron. Mat. 27, 1491998

24 J. Zhao , L. Qi , X. Wang L. Wang : Influence of Bi on microstructures evolution and mechanical properties in Sn–Ag–Cu lead free solder. J. Alloys Compd. 375, 1962004

25 K.S. Kim , S.H. Huh K. Suganuma : Effects of intermetallic compounds on properties of Sn–Ag–Cu lead free soldered joints. J. Alloys Compd. 352, 2262003

27 H. Oulfajrite , A. Sabbar , M. Boulghallat , A. Jouaiti , R. Lbibb A. Zrinelli : Electrochemical behavior of a new solder material Sn–In–Ag. Mater. Lett. 57, 43682003

32 S.A.M. Refaey S.S. Abd El-Rehim : Inhibition of chloride pitting corrosion of tin in alkaline and near neutral medium by some inorganic anions. Electrochim. Acta. 42, 6671997

34 R. Mishra R. Balasubramanium : Effect of nanocrystalline grain size on the electrochemical and corrosion behavior of nickel. Corros. Sci. 46, 30192004

35 L. Zhong , H. Zhu , J. Hu , S. Xiao F. Gau : A passivation mechanism of doped polyaniline on 410 stainless steel in de-aerated H2SO4 solution. Electrochim. Acta 51, 54942006

37 A. Kolics , J.C. Polkinghorne A. Wieckowski : Adsorption of sulfate and chloride ions on aluminium. Electrochim. Acta 43, 26051998

38 J.A. Ricardson G.C. Wood : A study of the pitting corrosion of Al by scanning electron microscopy. Corros. Sci. 10, 3131970

42 A. Katayama : Electroxidation of methanol on a platinum–tin oxide catalyst. J. Phys. Chem. 84, 3761980

45 T.J. Chuang , C.R. Brundle D.W. Rice : Interpretation of the x-ray photoemission spectra of cobalt oxides and cobalt oxide surfaces. Surf. Sci. 59, 4131979

Recommend this journal

Email your librarian or administrator to recommend adding this journal to your organisation's collection.

Journal of Materials Research
  • ISSN: 0884-2914
  • EISSN: 2044-5326
  • URL: /core/journals/journal-of-materials-research
Please enter your name
Please enter a valid email address
Who would you like to send this to? *



Full text views

Total number of HTML views: 3
Total number of PDF views: 5 *
Loading metrics...

Abstract views

Total abstract views: 114 *
Loading metrics...

* Views captured on Cambridge Core between September 2016 - 27th May 2017. This data will be updated every 24 hours.