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Polarity effect of electromigration on intermetallic compound formation in a Cu/Sn–9Zn/Cu sandwich

Published online by Cambridge University Press:  31 January 2011

Shih-Ming Kuo  and
Kwang-Lung Lin
Shih-Ming Kuo*
Affiliation:
Department of Materials Science and Engineering, National Cheng Kung University, Tainan, Taiwan 701, Republic of China; and Center for Micro/Nano Science and Technology, National Cheng Kung University, Tainan, Taiwan 701, Republic of China
Kwang-Lung Lin
Affiliation:
Department of Materials Science and Engineering, National Cheng Kung University, Tainan, Taiwan 701, Republic of China; and Center for Micro/Nano Science and Technology, National Cheng Kung University, Tainan, Taiwan 701, Republic of China
*
a)Address all correspondence to this author.e-mail: smi@mail.mse.ncku.edu.tw
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Abstract

This study investigated the polarity effect of electromigration (EM) on the interfacial intermetallic compounds (IMCs) (γ-Cu5Zn8, Cu6Sn5) formation at the anode and the cathode in a Cu/Sn-9Zn/Cu sandwich with a constant direct current density of 1.0 × 103 A/cm2 at 100 °C. The EM had different polarity effects on the nucleation and growth rates of the interfacial Cu5Zn8 IMC from those of Cu6Sn5 IMC. Upon current stressing, the growth rate of the Cu-Zn intermetallic compound (γ-Cu5Zn8) at the cathode interface was much faster than that at the anode. However, the nucleation and growth of the Cu6Sn5 IMC at the anode interface were enhanced, though retarded at the cathode, under the influence of electric current. The mechanism of EM-induced Cu6Sn5 IMC formation towards the anodic Cu is also discussed.

Keywords

Electromigration
Type
Articles
Information
Journal of Materials Research , Volume 23 , Issue 4 , April 2008 , pp. 1087 - 1094
Copyright
Copyright © Materials Research Society 2008

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