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Relationship between the MgOp/Cu interfacial bonding state and the arc erosion resistance of MgO/Cu composites

Published online by Cambridge University Press:  30 August 2017

Xiuhua Guo ,
Kexing Song ,
Shuhua Liang ,
Yanjun Zhou  and
Xu Wang
Xiuhua Guo*
Affiliation:
School of Materials Science and Engineering, Henan University of Science and Technology, Luoyang 471023, China; and Collaborative Innovation Center of Nonferrous Metals, Henan Province, Luoyang 471023, China
Kexing Song
Affiliation:
School of Materials Science and Engineering, Henan University of Science and Technology, Luoyang 471023, China; and Collaborative Innovation Center of Nonferrous Metals, Henan Province, Luoyang 471023, China
Shuhua Liang
Affiliation:
School of Materials Science and Engineering, Xi’an University of Technology, Xi’an, People’s Republic of China
Yanjun Zhou
Affiliation:
School of Materials Science and Engineering, Henan University of Science and Technology, Luoyang 471023, China; and Collaborative Innovation Center of Nonferrous Metals, Henan Province, Luoyang 471023, China
Xu Wang
Affiliation:
School of Materials Science and Engineering, Henan University of Science and Technology, Luoyang 471023, China; and Collaborative Innovation Center of Nonferrous Metals, Henan Province, Luoyang 471023, China
*
a) Address all correspondence to this author. e-mail: guoxiuhua@sina.com
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Abstract

MgO/Cu composites containing a 1.0% volume fraction of MgO particles were prepared by internal oxidation and powder metallurgy, respectively. The interfacial bonding state between the MgO particles and Cu matrix was characterized by scanning electron microscopy and transmission electron microscopy. The effect of the MgOp/Cu interfacial bonding state on the arc erosion resistance of the MgO/Cu composites was investigated, and the arc erosion resistance was examined using a JF04C electrical composite testing system. The results indicate that the 1.0 vol% MgO/Cu composite with a semicoherent MgOp/Cu interface experiences a lower arc erosion rate and smaller fluctuations of arcing energy than those of the 1.0 vol% MgO/Cu composite with an incoherent MgOp/Cu interface. Erosion morphology observations further indicate that a solid to liquid phase transformation occurs under arcing and MgO particles dispersed in the molten copper both prevent the copper matrix from splashing and enhance the arc erosion resistance of the MgO/Cu composites. While the shallow electric erosion pits are distributed uniformly on the arc surface of the MgO/Cu composites with a semicoherent interface, the MgO/Cu composite with an incoherent interface has deep and uneven pits on its arc surface, characterized by large electric erosion molten droplets.

Keywords

MgO/Cu compositeinterfacial bondingarc erosioninternal oxidation
Type
Articles
Information
Journal of Materials Research , Volume 32 , Issue 19 , 16 October 2017 , pp. 3753 - 3760
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Copyright
Copyright © Materials Research Society 2017 

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Footnotes

Contributing Editor: Jürgen Eckert

References

REFERENCES

Zhang, Y., Tian, B., Volinsky, A.A., Chen, X., Sun, H., Chai, Z., Liu, P., and Liu, Y.: Dynamic recrystallization model of the Cu–Cr–Zr–Ag alloy under hot deformation. J. Mater. Res. 31(9), 1275 (2016).CrossRefGoogle Scholar
Song, K.X., Liu, P., Tian, B.H., Dong, Q.M., and Xing, J.D.: Stabilization of nano-Al2O3p/Cu composite after high temperature annealing treatment. Mater. Sci. Forum 475–479, 993 (2005).Google Scholar
Guo, X., Song, K., Liang, S., Wang, X., and Zhang, Y.: Effect of Al2O3 particle size on electrical wear performance of Al2O3/Cu composites. Tribol. Trans. 59(1), 170 (2016).Google Scholar
Huang, S., Feng, Y., Liu, H., Ding, K., and Qian, G.: Electrical sliding friction and wear properties of Cu–MoS2–graphite–WS2 nanotubes composites in air and vacuum conditions. Mater. Sci. Eng., A 560, 685 (2013).CrossRefGoogle Scholar
Guo, X., Song, K., Liang, S., and Zheng, C.: Thermal expansion behavior of MgO/Cu composite with lower MgO volume fraction. Mater. Res. Bull. 47(11), 3211 (2012).Google Scholar
Rajkovic, D.B.V., Popovic, M., and Jovanovic, M.T.: The influence of powder particle size on properties of Cu–Al2O3 composites. Sci. Sintering 41, 185 (2009).CrossRefGoogle Scholar
Wang, Y.G. and De Hosson, J.T.M.: Secondary interface dislocations in internally oxidized MgO/Cu composite. J. Mater. Sci. Lett. 20(5), 389 (2001).Google Scholar
Varga, M., Molnár, Á., Mulas, G., Mohai, M., Bertóti, I., and Cocco, G.: Cu–MgO samples prepared by mechanochemistry for catalytic application. J. Catal. 206(1), 71 (2002).Google Scholar
Muller, D.A., Shashkov, D.A., Benedek, R., Yang, L.H., Silcox, J., and Seidman, D.N.: Atomic scale observations of metal-induced gap states at {222} MgO/Cu interfaces. Phys. Rev. Lett. 80(21), 4741 (1998).CrossRefGoogle Scholar
Tian, Y.Z. and Zhang, Z.F.: Stability of interfaces in a multilayered Ag–Cu composite during cold rolling. Scr. Mater. 68(7), 542 (2013).Google Scholar
Chu, K., Jia, C., Jiang, L., and Li, W.: Improvement of interface and mechanical properties in carbon nanotube reinforced Cu–Cr matrix composites. Mater. Des. 45, 407 (2013).Google Scholar
Shorowordi, K.M., Laoui, T., Haseeb, A.S.M.A., Celis, J.P., and Froyen, L.: Microstructure and interface characteristics of B4C, SiC and Al2O3 reinforced Al matrix composites: A comparative study. J. Mater. Process. Technol. 142(3), 738 (2003).Google Scholar
Wang, Y.G., Zhang, Z., Yan, G.H., and De Hosson, J.T.M.: Determination of near coincident site lattice orientations in MgO/Cu composite. J. Mater. Sci. 37(12), 2511 (2002).CrossRefGoogle Scholar
Speight, M.V.: Growth kinetics of grain-boundary precipitates. Acta Metall. 16(1), 133 (1968).CrossRefGoogle Scholar
Tatar, C. and Özdemir, N.: Investigation of thermal conductivity and microstructure of the α-Al2O3 particulate reinforced aluminum composites (Al/Al2O3-MMC) by powder metallurgy method. Phys. B 405(3), 896 (2010).Google Scholar
Roig, F.S. and Schoutens, J.E.: Theory of electrical resistivity of metal–matrix composites at cryogenic and higher temperatures. J. Mater. Sci. 21(7), 2409 (1986).CrossRefGoogle Scholar
Ruihua, L., Kexing, S., Shuguo, J., Xiaofeng, X., Jianxin, G., and Xiuhua, G.: Morphology and frictional characteristics under electrical currents of Al2O3/Cu composites prepared by internal oxidation. Chin. J. Aeronaut. 21(3), 281 (2008).Google Scholar
Shojaeepour, F., Abachi, P., Purazrang, K., and Moghanian, A.H.: Production and properties of Cu/Cr2O3 nano-composites. Powder Metall. 222, 80 (2012).Google Scholar
Rajkovic, V., Bozic, D., and Jovanovic, M.T.: Effects of copper and Al2O3 particles on characteristics of Cu–Al2O3 composites. Mater. Des. 31(4), 1962 (2010).CrossRefGoogle Scholar
Tian, B., Liu, P., Song, K., Li, Y., Liu, Y., Ren, F., and Su, J.: Microstructure and properties at elevated temperature of a nano-Al2O3 particles dispersion-strengthened copper base composite. Mater. Sci. Eng., A 435–436, 705 (2006).CrossRefGoogle Scholar
Song, K., Xing, J., Dong, Q., Liu, P., Tian, B., and Cao, X.: Optimization of the processing parameters during internal oxidation of Cu–Al alloy powders using an artificial neural network. Mater. Des. 26(4), 337 (2005).Google Scholar
Wang, X., Liang, S., Yang, P., and Fan, Z.: Effect of milling time on electrical breakdown behavior of Al2O3/Cu composite. J. Mater. Eng. Perform. 19(6), 906 (2010).Google Scholar
Wang, X., Liang, S., Yang, P., and Fan, Z.: Effect of Al2O3 particle size on vacuum breakdown behavior of Al2O3/Cu composite. Vacuum 83(12), 1475 (2009).CrossRefGoogle Scholar
Li, H., Wang, X., Guo, X., Yang, X., and Liang, S.: Material transfer behavior of AgTiB2 and AgSnO2 electrical contact materials under different currents. Mater. Des. 114, 139 (2017).Google Scholar