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The Development of a Holey Metal Oxide Support Film for High Temperature “Ex-Situ” Tem Oxidation Studies

Published online by Cambridge University Press:  02 July 2020

C.E. Kliewer ,
J. Varon ,
A. Malek  and
G.J. DeMartin
C.E. Kliewer
Affiliation:
ExxonMobil Research & Engineering, Rt. 22 East, Annandale, NJ08801
J. Varon
Affiliation:
ExxonMobil Research & Engineering, Rt. 22 East, Annandale, NJ08801
A. Malek
Affiliation:
ExxonMobil Research & Engineering, Rt. 22 East, Annandale, NJ08801
G.J. DeMartin
Affiliation:
ExxonMobil Research & Engineering, Rt. 22 East, Annandale, NJ08801
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Abstract

Transmission electron microscopy (TEM) has traditionally served as an important tool for understanding the physical properties of many materials. Recent improvements in “ex-situ” techniques have further strengthened the role of TEM as a unique characterization method.

The use of ExxonMobilfs dedicated reactor system for studying metal oxidation at moderate temperatures has been reported. However, high temperature oxidation studies have been limited by the use of holey carbon support films, which oxidize and disintegrate during these experiments. Consequently, a new method was developed to replace the holey carbon support film with a holey metal oxide support film that both maintains its structural integrity during high temperature oxidation and remains electron transparent.

The new support film was prepared using a commercially available, holey carbon coated TEM grid as a template (Figure 1). An Al metal film (∼10nm thick) was deposited onto the holey carbon coated side of the TEM grid using a magnetron sputtering system.

Type
Specimen Preparation for Materials Science
Information
Microscopy and Microanalysis , Volume 7 , Issue S2: Proceedings: Microscopy & Microanalysis 2001, Microscopy Society of America 59th Annual Meeting, Microbeam Analysis Society 35th Annual Meeting, Long Beach, California August 5-9, 2001 , August 2001 , pp. 1214 - 1215
Copyright
Copyright © Microscopy Society of America 2001

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References

References:

AIIard, L.F. et. al., Proc. Microscopy & Microanalysis 3 (1997) 595Google Scholar
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