Hostname: page-component-78c5997874-fbnjt Total loading time: 0 Render date: 2024-10-31T23:00:42.108Z Has data issue: false hasContentIssue false
  • English
  • Français

Analysis of Thermal Stress Induced Void Growth During Thermal Cycling

Published online by Cambridge University Press:  15 February 2011

D.D. Brown ,
M.A. Korhonen ,
P. Børgesen  and
C.-Y. Li
D.D. Brown
Affiliation:
Department of Materials Science & Engineering Cornell University, Ithaca, New York 14853
M.A. Korhonen
Affiliation:
Department of Materials Science & Engineering Cornell University, Ithaca, New York 14853
P. Børgesen
Affiliation:
Department of Materials Science & Engineering Cornell University, Ithaca, New York 14853
C.-Y. Li
Affiliation:
Department of Materials Science & Engineering Cornell University, Ithaca, New York 14853
Get access

Abstract

Recent work in thermal stress induced voiding in passivated lines has focussed on the isothermal, quasi-steady state growth of existing voids. In this work, the transient growth and shrinkage of voids during the thermal cycling of narrow, passivated lines was studied. Analysis of experimental data for passivated lines demonstrates the quick buildup and evolution of a backstress at the grain boundary during heating and cooling. This backstress greatly reduces the driving force for void growth at higher temperatures and must be accounted for in stress induced void growth models for the case of appreciably varying temperatures in short time scales.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 308: Symposium M1 – Thin Films: Stresses and Mechanical Properties IV , 1993 , 291
Copyright
Copyright © Materials Research Society 1993

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1 Yue, J.T., Funsten, W.P., and Taylor, R.V., Proc. 23rd Int. Reliab. Phys. Symp. (IEEE, New York, 1985) 126 CrossRefGoogle Scholar
2 Ryan, J.G., Riendeau, J.B., Shore, S.E., Slusser, G.J., Beyar, D.C., Bouldin, D.P., and Sullivan, T.D., J. Vac. Sci. Technol. A8 (1990)Google Scholar
3 Børgesen, P., Korhonen, M.A., Brown, D.D., and Li, C.-Y., in Stress-Induced Phenomena in Metallization I, edited by Li, C- Y., Totta, P., and Ho, P. (Amer. Vac. Soc. Ser. 13, New York, 1992), pp. 219–235.Google Scholar
4 Børgesen, P., Lee, J.K., Korhonen, M.A., and Li, C.-Y., Mat. Res. Soc. Symp. Proc. 239 (1992)Google Scholar
5 Li, C.-Y., Black, R.D., and Lafontaine, W.R., Appl. Phys. Lett. 53. (1988)Google Scholar
6 Børgesen, P., Korhonen, M.A., Basa, C., Lafontaine, W.R., Land, B., and Li, C.-Y., Mat. Res. Symp. Proc. 225 (1991)Google Scholar
7 Herring, C., in Physics of Powder Metallurgy, edited by Kingson, W.E. (McGraw-Hill, New York, 1951), p. 143.Google Scholar
8 Korhonen, M.A., Paszkiet, C.A., and Li, C.-Y., J. Appl. Phys. 69, 8083 (1991)CrossRefGoogle Scholar
9 Hull, D. and Rimmer, D.E., Philos. Mag. 4., 673 (1959)CrossRefGoogle Scholar
10 Tezaki, A., Mineta, T., Egawa, H., and Noguchi, T., IEEE/IRPS 221 (1990)Google Scholar
11 Dyson, B.F., Can. Met. Quart. 18, 31 (1979)CrossRefGoogle Scholar
12 Jackson, M.S. and Li, C.-Y.. Acta Met. 30, 1993 (1982)Google Scholar
13 Yost, F.G., Scripta Met. 23, 1323 (1989)CrossRefGoogle Scholar