Underfill delamination is one of the most common failure mechanisms for the Direct Chip Attach (DCA) assemblies. This paper, based on finite element and analytical analysis of stress concentrations, proposes the possible delamination trends of the underfill in the DCA assembly. The results explain well the recent experimental observations. The analysis suggests that good adhesion between underfill and solder joints might help compensate for the relatively poor adhesion of the underfill/passivation interfaces. It also suggests that voids in the underfill material may sometimes be detrimental.
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