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Evolution of Stress; Phase Formation and Microstructure in TiCux-Alloy Films

  • S. Bertel (a1) and R. Abermann (a1)
Abstract

The internal stress of TiCux-alloy films on alumina substrates was measured in situ under UHV-conditions as a function of substrate temperature and stoichiometry using a cantilever beam technique.

The stress vs. thickness curves of alloy films with TiCu0.5, TiCu, TiCu2 and TiCu3 stoichiometry indicate that the film growth is amorphous at 130°C and polycrystalline at 350°C substrate temperature, which was confirmed by TEM-investigations. Furthermore TED-results of alloys deposited at 350°C imply that the TiCux-alloy-phases formed at that temperature are Ti2Cu, γ-TiCu, TiCu3 and TiCu4.

The influence of substrate temperature on the growth of TiCux-alloy films (x = 1) was investigated in more detail. At substrate temperatures below 300°C the stress vs. thickness curves indicate the formation of amorphous alloy films, again confirmed by TEM- and TED-analysis. At substrate temperatures around 300°C a strong tensile stress contribution above a mean thickness of about 20 nm indicates a change in the growth mode and thus microstructure of the alloy film. The corresponding TEM- and TED-micrographs show quasi single-crystalline films. Finally at 350°C substrate temperature the stress vs. thickness curves indicate once again a change in the film growth mode, the film structure is polycrystalline and the formation of γ-TiCu is deduced fore TED-results.

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References
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2. Abermann, R., Vacuum 41, p. 1279 (1990)
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4. Koch, R., Leonhard, H., Thumer, G. and Abermann, R., Rev. Sci. Instrum. 61, p. 3859 (1990)
5. Abermann, R., Thin Solid Films 186, p. 233 (1990)
6. Subramaman, P. R., Chakrabarti, D. J., Phase Diagrams of Binary Copper Alloys (1994), p. 447
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MRS Online Proceedings Library (OPL)
  • ISSN: -
  • EISSN: 1946-4274
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