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A Kinetic and Thermal Study of the Superalloy Melt Spinning Process

Published online by Cambridge University Press:  21 February 2011

S. C. Huang  and
R. P. Laforce
S. C. Huang
Affiliation:
General Electric Corporate Research and Development, P.O. Box 8, Schenectady, NY 12301
R. P. Laforce
Affiliation:
General Electric Corporate Research and Development, P.O. Box 8, Schenectady, NY 12301
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Abstract

The correlation between ribbon thickness and the length of the melt puddle residing on the surface of a melt-spinning wheel was established for a Ni-base superalloy. Since the melt puddle length defines the solidification time in which a ribbon with a certain thickness is formed, the above correlation allowed a direct derivation of the propagation velocity of the solid-liquid interface. The solidification rate V (mm/s) so obttined as a function of ribbon thickness S (mm) is V = 3.54S−1. Further, the above solidification correlation was analyzed using heat transfer considerations to yield information about the ribbon-wheel interfacial thermal conductance, the solid-liquid interfacial temperature, and the local cooling rate through the ribbon thickness. These thermal results are compared to those deduced from the secondary dendrite arm spacing measurements. Finally, there is a discussion on the ribbon microstructure based on our rapid solidification kinetic result.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 28: Symposium F – Rapidly Solidified Metastable Materials , 1983 , 125
Copyright
Copyright © Materials Research Society 1984

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References

REFERENCES

1. Tiller, W.A., Rutter, J.W., Jackson, K.A. and Chalmers, B., Acta Met., 1 (1953) 428.10.1016/0001-6160(53)90126-6Google Scholar
2. Mullins, W.W. and Sekerka, R.F., J. Appl. Phys., 35 (1964) 444.10.1063/1.1713333Google Scholar
3. Coriell, S.R. and Sekerka, R.F., Proc. 2nd Int. Conf. Rapid Solidification Processing, Ed. Mehrabian, R. et al. , Reston, Virginia, 1980, p.35.Google Scholar
4. Huang, S.C. and Fiedler, H.C., Mat. Sci. Eng., 51 (1981) 39.10.1016/0025-5416(81)90104-XGoogle Scholar
5. Huang, S.C. and Ritter, A.M., Proc. AIME Symp. Chem. Phys. Rapidly Solidified Materials, St. Louis, Missouri, October 1982, Ed. Berkowitz, B.J. and Scattergood, R.O., p. 25.Google Scholar
6. Davies, H.A., Shohoji, N. and Warrington, D.H., Proc. 2nd Int. Conf.Rapid Solidification Processing, Ed. Mehrabian, R. et al. , Reston, Virginia, 1980, p. 153.Google Scholar
7. Warrington, D.H., Davies, H.A. and Shohoji, N., Proc. 4th Int. Conf. Rapidly Quenched Metals, Ed. Masumoto, T. et al. , Sendai, 1981, p. 69.Google Scholar
8. Davies, H.A., General Electric Technical Information Series, 82CRD318, 1982.Google Scholar
9. Carslaw, H.S. and Jaeger, J.C., Conduction of Heat in Solids, Oxford Univ. Press, 1959.Google Scholar
10. Adams, C.M., in Liquid Metals and Solidification, American Society for Metals, Metals Park, Ohio, 1958.Google Scholar
11. “High Temperature High Strength Ni Base Alloys,” The International Nickel Co., Inc., 1968.Google Scholar