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Multilayer Composite Diamond Heat Spreaders for Electronic Packaging
Published online by Cambridge University Press: 10 February 2011
Abstract
Heat spreader characteristics of single layer and multilayer diamond composite substrates are determined by bonding to electronic device wafers. Preparation of diamond substrates, metallization and bonding procedures to device wafers are described. Infrared microscopy imaging of the bonded device wafers is used to determine the heat spreading characteristics. Advantages associated with multilayer diamond composite heat spreaders are discussed.
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- Copyright © Materials Research Society 1997
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