The mechanical properties of thin film are very critical for the performance of MEMS devices. Since Poly-silicon film is of great use in MEMS, this study investigates the surface modification by various plasma treatments to finely tune the chemical and mechanical properties of poly-silicon film. Various plasma treatments, including H2, O2, and NH3, were implemented to modify the original Si-Si film bonding, Young's modulus, and hardness of poly-silicon film. These were significant Si-O, Si-OH/Si-H and Si-NH2/Si-N bonds formed after O2, H2 and NH3 plasma treatment, respectively. According to the H analysis from SIMS depth profile of, the thickness of surface modified layer would be ranged from 50 to 120 nm. In summary, the surface modification with H2 plasma can reduce the elastic modulus of poly-silicon film for about 32.3%; moreover, the following vacuum annealing will further reduce the elastic modulus for about 60.2%. Therefore, surface modification with an adequate plasma treatment would be an effective method to change the chemical and mechanical properties of poly-silicon film.
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