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Thermomechanical Stresses in Copper Interconnect/Low-κ Dielectric Systems
Published online by Cambridge University Press: 17 March 2011
Abstract
Numerical simulations of thermal stresses in copper interconnect and low-κ dielectric systems are carried out. The analyses include two- and three-dimensional finite element modeling of the interconnect structure. Various combinations of metal, oxide and polymer-based low-κ dielectric schemes are considered in the simulation. The evolution of stresses and deformation pattern in copper, barrier layers, and the dielectrics are critically assessed.
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- Copyright © Materials Research Society 2004
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