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Indentation Technique to Investigate Elastic Moduli of Thin Films on Substrates
Published online by Cambridge University Press: 22 February 2011
Abstract
Closed-form elasticity solutions are introduced, that predict the average displacement beneath square and triangular, uniformly loaded areas at the surface of a bilayer. The solutions aid in the application of depth-sensing indentation techniques for measuring thin film elastic moduli. The elasticity solutions agree closely with experimental data of Al, Si, 1 μm Al on Si, and 2 μm Cr on Si. The case of poor adhesion between the film and substrate is briefly examined.
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- Copyright © Materials Research Society 1989
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