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Morphology and Microstructure Evolution of Multilayer Au/Cr/Si Thin Films Subject to Annealing

Published online by Cambridge University Press:  01 February 2011

David Miller
Affiliation:
Department of Mechanical Engineering-University of Colorado, Boulder, CO 80309
Cari Herrmann
Affiliation:
Department of Mechanical Engineering-University of Colorado, Boulder, CO 80309 Department of Chemistry and Biochemistry-University of Colorado, Boulder, CO 80309
Hans Maier
Affiliation:
Lehrstuhl für Werkstoffkunde (Materials Science), University of Paderborn, 33095 Paderborn, Germany
Steve George
Affiliation:
Department of Chemistry and Biochemistry-University of Colorado, Boulder, CO 80309
Conrad Stoldt
Affiliation:
Department of Mechanical Engineering-University of Colorado, Boulder, CO 80309
Ken Gall
Affiliation:
Department of Mechanical Engineering-University of Colorado, Boulder, CO 80309
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Abstract

Au/Cr/Si microcantilevers were studied in their as-deposited condition and annealed state, with emphasis on a thermal treatment of 225 °C for 24 hours. Change in beam curvature was monitored during isothermal hold as a function of time. Secondary grain growth was observed in the gold, which contained non-uniformly distributed twins and dislocation defects. Diffusional transport of the chromium layer was observed during annealing. Nodules arranged in the “rolling hill” topography were observed at the free surface, both before and after annealing. Nanometer thick coatings of alumina grown by atomic layer deposition improved the uniformity of both microstructure evolution and curvature evolution during high-temperature annealing.

Type
Research Article
Copyright
Copyright © Materials Research Society 2005

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References

REFERENCES

1. Holloway, P.H. and Nelson, G. C., Sandia Lab. Rep. SAND 75–0216, 1975, pp. 147.Google Scholar
2. Koester, D. A., Cowen, A., Mahadevan, R., Stonefeild, M., and Hardy, B., MUMPs Design Rules: Revision 10, MEMSCAP Inc., 2003.Google Scholar
3. Elam, J. W., Groner, M. D., and George, S. M., Rev. Sci. Instr., 73 (8), 2002, pp. 29812987.Google Scholar
4. Kempshall, B., Giannuzzi, L., Prenitzer, B., Stevie, F., and Da, S.. J. Vac. Sci. Technol. B, 20 (1), 2002, pp. 286290.Google Scholar
5. Chidsey, C., Loiacono, D., Sleator, T., Nakahara, S.. Surf. Sci., 200, 1988, pp. 4566.Google Scholar
6. Thompson, C.. Annu. Rev. Mat. Sci., 20, 1990, pp. 245268.Google Scholar
7. Golan, Y., Margulis, L., and Rubinstein, I.. Surf. Sci., 264, 1992, pp. 312326 Google Scholar
8. Nix, W., Met. Trans. A, 20A, 1989, pp. 22172245.Google Scholar
9. Gardner, D., and Flinn, P.. J. Appl. Phys., 67 (4), 1990, pp. 18311844.Google Scholar
10. Mullins, W.. Acta Mat., 6, 1958, pp. 414427.Google Scholar
11. Harris, K. and King, A.. Proc. Mat. Res. Soc. Symp., 356, 1995, pp. 7580.Google Scholar