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Effective Utilization of STEM Imaging Capability in FIB for Physical Failure Analysis on 20nm & 14nm Transistor Nodes in Semiconductor Wafer Foundries

Published online by Cambridge University Press:  09 October 2013

W. Zhao ,
D. Nedeau ,
S. Kodali ,
J. Huang ,
C.-K. Oh ,
S.-K. Lim ,
R. Rai ,
Z.-H. Mai  and
J. Lam
W. Zhao
Affiliation:
D. Nedeau
Affiliation:
S. Kodali
Affiliation:
J. Huang
Affiliation:
C.-K. Oh
Affiliation:
S.-K. Lim
Affiliation:
R. Rai
Affiliation:
Z.-H. Mai
Affiliation:
J. Lam
Affiliation:

Abstract

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Extended abstract of a paper presented at Microscopy and Microanalysis 2013 in Indianapolis, Indiana, USA, August 4 – August 8, 2013.

Type
Abstract
Information
Microscopy and Microanalysis , Volume 19 , Issue S2: Proceedings of Microscopy & Microanalysis 2013 , August 2013 , pp. 902 - 903
Copyright
Copyright © Microscopy Society of America 2013